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  stencil Datasheet PDF File

For stencil Found Datasheets File :: 1989    Search Time::4ms    
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    NUP4103FC NUP4103FCT1 NUP4103FCT1G

ON Semiconductor
Part No. NUP4103FC NUP4103FCT1 NUP4103FCT1G
OCR Text ...Type Solder Mask Opening Solder stencil Thickness stencil Aperture Solder Flux Ratio Solder Paste Type Trace Finish Trace Width 500 mm Pitch 300 mm Solder Ball 250 mm +25 / -0 Round NSMD 350 mm 25 125 mm 250 x 250 mm sq. 50/50 No Clean Type...
Description FOUR CHANNEL ESD ARRAY

File Size 130.11K  /  5 Page

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    74LX1G04STR 74LX1G04CTR 74LX1G04BJR 74LX1G04

ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
意法半导
Part No. 74LX1G04STR 74LX1G04CTR 74LX1G04BJR 74LX1G04
OCR Text ... recommends the use of a solder stencil aperture of 330 x 330 m maximum and a typical stencil thickness of 125m. Flip-Chips are fully compatible with the use of near eutectic 95.5Sn 4Ag 0.5Cu solder paste with no clean flux. ST's recommenda...
Description LOW VOLTAGE CMOS SINGLE INVERTER WITH 5V TOLERANT INPUT

File Size 153.85K  /  13 Page

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    EMIF02-MIC03F3 EMIF02-MIC02F2 EMIF02-MIC02F3 EMIF02-MIC03F1 EMIF02-MIC03F2 EMIF02-MIC02F1

STMicroelectronics N.V.
意法半导
ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
Part No. EMIF02-MIC03F3 EMIF02-MIC02F2 EMIF02-MIC02F3 EMIF02-MIC03F1 EMIF02-MIC03F2 EMIF02-MIC02F1
OCR Text ...ecommended , 300m max Solder stencil opening : 330m Dot, ST logo xx = marking z = packaging location yww = datecode (y = year ww = week) 365 240 365 E Solder mask opening recommendation : 340m min for 300m copper pad diam...
Description 2 LINES EMI FILTER INCLUDING ESD PROTECTION 2线的EMI滤波器,ESD保护

File Size 68.00K  /  7 Page

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    EMIF02-SPK01F1 EMIF02-SPK01F2 EMIF02-SPK02F1 EMIF02-SPK02F2 EMIF02-SPK03F1 EMIF02-SPK03F2

STMicroelectronics
Part No. EMIF02-SPK01F1 EMIF02-SPK01F2 EMIF02-SPK02F1 EMIF02-SPK02F2 EMIF02-SPK03F1 EMIF02-SPK03F2
OCR Text ...ended , 300m max E Solder stencil opening : 330m Solder mask opening recommendation : 340m min for 315m copper pad diameter xxz y ww 5/7 EMIF02-SPK01F2 Figure 14: FLIP-CHIP Tape and Reel Specification Dot identifying Pin...
Description 2 LINE EMI FILTER AND ESD PROTECTION

File Size 266.16K  /  7 Page

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    IAM-92516 IAM-92516-TR1 IAM-92516-TR2 IAM-92516-BLK

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. IAM-92516 IAM-92516-TR1 IAM-92516-TR2 IAM-92516-BLK
OCR Text ... signal. 5 PCB Layout and stencil Design Refer to Agilent's web site www.agilent.com/view/rf Ordering Information Part Number IAM-92516-TR1 IAM-92516-TR2 IAM-92516-BLK Devices per Container 1000 5000 100 Container 7" reel ...
Description IAM-92516 · Low Cost, High Linearity, Low LO Drive, Up and Down converter
High Linearity GaAs FET Mixer
From old datasheet system

File Size 159.16K  /  8 Page

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    AGILENT TECHNOLOGIES
Part No. HSDL-9001
OCR Text ... 1.0 Solder Pad, Mask and Metal stencil Aperture stencil APERTURE METAL stencil FOR SOLDER PASTE PRINTING LAND PATTERN SOLDER MASK PCBA Figure 7. stencil and PCBA. 1.1 Recommended Land Pattern 0.9 MOUNTING CENTRE 1 ...
Description Analog Output Miniature Ambient Light Photo Sensor

File Size 82.71K  /  12 Page

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    HSDL-9001

Agilent(Hewlett-Packard)
Part No. HSDL-9001
OCR Text ... 1.0 Solder Pad, Mask and Metal stencil Aperture stencil APERTURE METAL stencil FOR SOLDER PASTE PRINTING LAND PATTERN SOLDER MASK PCBA Figure 7. stencil and PCBA. 1.1 Recommended Land Pattern 0.9 MOUNTING CENTRE 1 ...
Description Miniature Surface-Mount Ambient Light Photo Diode

File Size 83.88K  /  12 Page

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    HMC1042L

Honeywell Solid State Electronics Center
Part No. HMC1042L
OCR Text ... www.honeywell.com HMC1042L stencil Design and Solder Paste A 4 mil stencil and 100% paste coverage is recommended for the electrical contact pads. The HMC1042L has been tested successfully with no-clean solder paste. BASIC DEVICE OP...
Description 2-Axis Magnetic Sensor

File Size 405.40K  /  6 Page

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    HMC1043T_R HMC1043 HMC1043T/R

Honeywell International Inc.
Honeywell Solid State Electronics Center
Part No. HMC1043T_R HMC1043 HMC1043T/R
OCR Text ... www.honeywell.com HMC1043 stencil Design and Solder Paste A 4 mil stencil and 100% paste coverage is recommended for the eight electrical contact pads. Do not apply paste on the leveling pads. The HMC1053L has been tested successfully...
Description 3-Axis Magnetic Sensor

File Size 123.75K  /  6 Page

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    HMC560LM3

Hittite Microwave Corporation
Part No. HMC560LM3
OCR Text ...plied to the PCB using either a stencil printer or dot placement. The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical performance. Excess solder may ...
Description GaAs MMIC FUNDAMENTAL SMT MIXER, 24 - 40 GHz

File Size 322.45K  /  8 Page

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For stencil Found Datasheets File :: 1989    Search Time::4ms    
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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