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Matsushita Electric Works(Nais)
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| Part No. |
AQV210HLA AQV210HLAX AQV210HLAZ
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| OCR Text |
...acking style tube tape and reel picked from the 1/2/3-pin side picked from the 4/5/6-pin side ac/dc type reinforced 5,000 v 350 v 130 ma aqv210hl aqv210hla aqv210hlax aqv210hlaz 1 tube contains 50 pcs. 1 batch contains 500 pcs. 1,000 ... |
| Description |
PhotoMOS relay, GU (general use) type, 1-channel (form A ), current limit function. Output rating: load voltage 350V, load current 130 mA. Tube packing style. PhotoMOS relay, GU (general use) type, 1-channel (form A ), current limit function. Output rating: load voltage 350V, load current 130 mA. Tape and reel packing style, picked from the 1/2/3-pin side. PhotoMOS relay, GU (general use) type, 1-channel (form A ), current limit function. Output rating: load voltage 350V, load current 130 mA. Tape and reel packing style, picked from the 4/5/6-pin side.
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| File Size |
41.12K /
3 Page |
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it Online |
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Panasonic, Corp.
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| Part No. |
ARE13A03Z
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| OCR Text |
...l only) tape and reel packing (picked from 12/13/14 pin side) 1areex. note: tape and reel packing symbol -z is not marked on the relay. x type tape and reel packing (picked from 8/9/10/11/12/13/14-pin side) is also available. suffix x ins... |
| Description |
2.6GHz Relay, 1 Form C, 0.5A 30VDC Relay, 75ohms, SMD RF RELAY, SPDT, MOMENTARY, 0.067A (COIL), 3VDC (COIL), 200mW (COIL), 0.01A (CONTACT), 24VDC (CONTACT), 2600MHz, SURFACE MOUNT-STRAIGHT
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| File Size |
178.98K /
4 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
MADP-000910-13050T MA4AGCP910 MA4AGFCP910
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| OCR Text |
...andled with plastic tweezers or picked and placed with a #27 tip vacuum pencil.
Assembly Requirements using Electrically Conductive Ag Epoxy and Solder
These chips are designed to be inserted onto hard or soft substrates with the juncti... |
| Description |
AlGaAs Flip-Chip PIN Diode 100MHz to 50GHz
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| File Size |
124.12K /
6 Page |
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it Online |
Download Datasheet
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MACOM[Tyco Electronics]
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| Part No. |
MADS-001317-1320AG
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| OCR Text |
...andled with plastic tweezers or picked and placed automatically with a #27 tip vacuum pencil.
Assembly Requirements using Tin Lead Solder
This Flip Chip Diode employs a 6um thick, Sn 63 / Pb 37 Solderable interface as part of the 50m hi... |
| Description |
GaAs Solder Bump Flip Chip Schottky Diode
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| File Size |
109.97K /
3 Page |
View
it Online |
Download Datasheet
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Price and Availability
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