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  material-copper Datasheet PDF File

For material-copper Found Datasheets File :: 24472    Search Time::1.984ms    
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    7101J3AV2KE11 7101J1AV2QI32 7101J2AV2BE23 7101J2AV2BE33 7101J2ZBE32 7101J8AKI33 7101J2AV2KI33 7101J3AKI33 7101J3AV2KI33

ITT Industries
Part No. 7101J3AV2KE11 7101J1AV2QI32 7101J2AV2BE23 7101J2AV2BE33 7101J2ZBE32 7101J8AKI33 7101J2AV2KI33 7101J3AKI33 7101J3AV2KI33 7101J1ABE21 7101J1ABE22 7101J1ABE11 7101J1AV2BE33 7101J3AV2BE33 7101J8AV2BE33
OCR Text ...n J93 Lever, snap in Contact Material B (STD.) Gold Q (STD.) Silver K Gold Terminations M Silver A (STD.) Right angle, PC thru hole G Gol...Copper alloy, with gold plate over nickel plate. Q contact material: Coin silver, silver plated. See...
Description    Rocker and Lever Handle Switches

File Size 1,721.69K  /  20 Page

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    List of Unclassifed Man...
Part No. 1865AN3U1000
OCR Text ... in. conductor material bc - bare copper insulation: insulation material gas-injected fhdpe - foam high density polyethylene insulation diameter .094 in. outer shield: outer shield material trade name duo...
Description 25 AWG stranded (19x37) .021 bare copper conductor, gas-injected foam HDPE insulation

File Size 27.18K  /  4 Page

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    CXG1101TN

Sony, Corp.
Sony Corporation
Part No. CXG1101TN
OCR Text .... PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE TSSOP-10P-L01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g SCT Ass'y 2.8 0.1 10 6 10PIN TSSOP(PLASTIC) 1.2MAX 0.1 ...
Description SP3T Antenna Switch for TDMA800/1900/AMPS800 Triple Mode Application SP3T天线开关TDMA800/1900/AMPS800三重模式的应
SP3T Antenna Switch for TDMA800/1900/AMPS800

File Size 52.93K  /  4 Page

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    0039300163

Molex Electronics Ltd.
Part No. 0039300163
OCR Text ...Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Or...COPPER 39-30-0100 5569-10A2-210 SEE 39-30-0120 5569-12A2-210 94V-2 NOTE 2 39-30-0140 5569-14A2-210 O...
Description 4.20mm (.165) Pitch Mini-Fit Jr. Header, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits
4.20mm (.165") Pitch Mini-Fit Jr. Header, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits

File Size 272.60K  /  9 Page

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    CXG1104TN

Sony Corporation
Part No. CXG1104TN
OCR Text .... PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE TSSOP-10P-L01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g 10PIN TSSOP (PLASTIC) 1.2MAX 2.8 0.1 10 6 0.1 (0.1) + 0.02...
Description High Power SPDT Switch with Logic Control

File Size 51.14K  /  4 Page

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    0039300164 39-30-0164 5569-16A2GS-210

Molex Electronics Ltd.
Part No. 0039300164 39-30-0164 5569-16A2GS-210
OCR Text ...Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Or...COPPER 39-30-0100 5569-10A2-210 SEE 39-30-0120 5569-12A2-210 94V-2 NOTE 2 39-30-0140 5569-14A2-210 O...
Description 4.20mm (.165) Pitch Mini-Fit Jr.?/a> Header, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, PA Polyamide Nylon 6/6 94V-0, 0.76μm (30μ) Gold (Au) Selective Plating
4.20mm (.165) Pitch Mini-Fit Jr. Header, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, PA Polyamide Nylon 6/6 94V-0, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 276.05K  /  9 Page

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    CXG1106EN

Sony Corporation
Part No. CXG1106EN
OCR Text ...N PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE VSON-16P-01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02 g 16PIN VSON (PLASTIC) 0.9 MAX 0.6 3.5 A S 0.35 0.1 2.5 0.05...
Description High Power 2 × 4 Antenna Switch MMIC with Integrated Control Logic
High Power 2 】 4 Antenna Switch MMIC with Integrated Control Logic

File Size 71.62K  /  6 Page

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    1ML06-031-05

RMT Ltd.
Part No. 1ML06-031-05
OCR Text ...d with some thermoconductive material such as graphite or diamond powders, silver, sin and others. the application of a specific type ...copper 2. insulated wires 3. insulated color coded type t max k q max w i max ...
Description Thermoelectric Module

File Size 817.51K  /  13 Page

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For material-copper Found Datasheets File :: 24472    Search Time::1.984ms    
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