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TOSHIBA[Toshiba Semiconductor]
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| Part No. |
CMS09
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| OCR Text |
...Note: Device mounted on a glass-epoxy board (board size: 50 mm 50 mm, soldering land: 6 mm 6 mm)
Weight: 0.023 g (typ.)
Electrical Characteristics (Ta = 25C)
Characteristics Symbol VFM (1) Peak forward voltage VFM (2) VFM (3) Repet... |
| Description |
Schottky Barrier Rectifier Trench Schottky Barrier Type Switching Mode Power Supply Applications Portable Equipment Battery Applications
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| File Size |
122.17K /
5 Page |
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it Online |
Download Datasheet
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TOSHIBA
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| Part No. |
TPC8075
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| OCR Text |
...te 2: device mounted on a glass-epoxy board (a), figure 5.1 note 3: device mounted on a glass-epoxy board (b), figure 5.2 note 4: v dd = 24 v, t ch = 25 (initial), l = 0.5 mh, r g = 1 ? , i ar = 18 a fig. fig. fig. fig. 5.1 5.1 5... |
| Description |
Power MOSFET (N-ch single 30V<VDSS≤60V)
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| File Size |
236.46K /
9 Page |
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it Online |
Download Datasheet |
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CREE[Cree, Inc]
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| Part No. |
CXXXUT200-SXXXX C460UT200-SXXXX C470UT200-SXXXX
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| OCR Text |
... 3/4 package (with Hysol OS4000 epoxy) for characterization. Ratings for other packages may differ. The forward currents (DC and Peak) are not limited by the die but by the effect of the LED junction temperature on the package. The junction... |
| Description |
Cree㈢ UltraThin⑩ LED
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| File Size |
262.06K /
5 Page |
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it Online |
Download Datasheet |
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Price and Availability
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