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Molex Electronics Ltd.
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Part No. |
87759-2815 0877592815
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
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File Size |
279.39K /
6 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
447-5025-063
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Description |
VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 25 positions, open, 4.25mm (0.167in), Header.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
87759-0615 0877590615
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
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File Size |
279.45K /
6 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
447-5010-063
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Description |
VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 10 positions, open, 4.25mm (0.167in), Header.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
87759-3415 0877593415
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
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File Size |
279.39K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
447-5025-061
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Description |
VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 25 positions, open, 4.75mm (0.187in), Header.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
87759-4214 0877594214
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 42 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
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File Size |
420.09K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
447-5010-061
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Description |
VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 10 positions, open, 4.75mm (0.187in), Header.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
87759-2851 0877592851
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 28 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free 2.00mm (.079) Pitch Milli-Grid?Header, Surface Mount, Vertical, 28 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Lead-free
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File Size |
174.05K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
447-5025-062
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Description |
VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 25 positions, open, 6.25mm (0.246in), Header.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
447-5010-062
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Description |
VHDM-HSD™, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row eHSD, 10 positions, open, 6.25mm (0.246in), Header.
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Tech specs |
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Official Product Page
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Texas Instruments |
Part No. |
5962-8775901MSA
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Description |
Octal Buffers/Drivers With 3-State Outputs 20-CFP -55 to 125
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0877595064 87759-5064
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap 2.00mm (.079) Pitch Milli-Grid?Header, Surface Mount, Vertical, 50 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without Press-fit Plastic Pegs, Pick-and-Place Cap
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File Size |
420.97K /
8 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
Part No. |
5962-8775901M2A
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Description |
Octal Buffers/Drivers With 3-State Outputs 20-LCCC -55 to 125
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Tech specs |
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Official Product Page
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Texas Instruments |
Part No. |
5962-8775901MRA
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Description |
Octal Buffers/Drivers With 3-State Outputs 20-CDIP -55 to 125
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0877595066 87759-5066
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Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs 2.00mm (.079) Pitch Milli-Grid?Header, Surface Mount, Vertical, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs
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File Size |
298.85K /
6 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
Part No. |
10144754-2211LF
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Description |
Minitek® Pwr 3.0 BMI, Dual Row, Right Angle Through Hole Header, 80u\\ Tin overall plating, 22 Positions, Black Color, LCP, GW Compatible, Tray packing.
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Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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