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  5812-4CC Datasheet PDF File

For 5812-4CC Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    IRG4CC30SB

International Rectifier
Part No. IRG4CC30SB
Description IRG4CC30SB IGBT Die in Wafer Form

File Size 34.55K  /  1 Page

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Amphenol Communications Solutions

Part No. 75915-812HLF
Description Dubox® 2.54mm, Board to Board Connector,Vertical Receptacle, Through Hole, Single row , 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    IRG4CC40UB

International Rectifier
Part No. IRG4CC40UB
Description IRG4CC30UB IGBT Die in Wafer Form

File Size 34.15K  /  1 Page

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Amphenol Communications Solutions

Part No. 85758-1201LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Receptacle, Straight, Press-Fit.
Tech specs    

Official Product Page

    Hammond Manufacturing L...
Part No. PCJ1084CCF
Description DATA SUBJECT TO CHANGE WITHOUT NOTLCE

File Size 276.13K  /  1 Page

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Amphenol Communications Solutions

Part No. 68458-127HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled Header, Through Hole, Single Row, 27 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    IRG4CC40FB

International Rectifier
Part No. IRG4CC40FB
Description IRG4CC40FB IGBT Die in Wafer Form

File Size 34.37K  /  1 Page

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Amphenol Communications Solutions

Part No. 68758-129HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 29 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    IRG4CC40KB

International Rectifier
Part No. IRG4CC40KB
Description IRG4CC40KB IGBT Die in Wafer Form

File Size 34.29K  /  1 Page

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Amphenol Communications Solutions

Part No. 495-8125-B62
Description VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row VHDM, 25 positions, left, adv mate, B-Key, 6.25mm (0.246in), Header.
Tech specs    

Official Product Page

    IRG4CC40RB

International Rectifier
Part No. IRG4CC40RB
Description IRG4CC40RB IGBT Die in Wafer Form

File Size 26.02K  /  1 Page

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Amphenol Communications Solutions

Part No. 495-8125-D64
Description VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row VHDM, 25 positions, left, adv mate, D-Key, 5.15mm (0.202in), Header.
Tech specs    

Official Product Page

    IRG4CC40SB

International Rectifier
Part No. IRG4CC40SB
Description IRG4CC40SB IGBT Die in Wafer Form

File Size 38.59K  /  1 Page

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Amphenol Communications Solutions

Part No. 495-8125-G62
Description VHDM®, Backplane connectors, Vertical Orientation, Press Fit Termination, 8 Row VHDM, 25 positions, left, adv mate, G-Key, 6.25mm (0.246in), Header.
Tech specs    

Official Product Page

    IRG4CC20FB

International Rectifier
Part No. IRG4CC20FB
Description IRG4CC20FB IGBT Die in Wafer Form

File Size 38.74K  /  1 Page

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Amphenol Communications Solutions

Part No. 68758-125HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 25 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    IRG4CC10UB

International Rectifier
Part No. IRG4CC10UB
Description IRG4CC10UB IGBT Die in Wafer Form

File Size 40.97K  /  1 Page

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Amphenol Communications Solutions

Part No. 77313-158-12LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 12 Positions
Tech specs    

Official Product Page

    IRG4CC60FB

International Rectifier
Part No. IRG4CC60FB
Description IRG4CC60FB IGBT Die in Wafer Form

File Size 27.19K  /  1 Page

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Amphenol Communications Solutions

Part No. 68758-121HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 21 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 5812-4CC Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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