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  52610-2816 Datasheet PDF File

For 52610-2816 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    UPA2816T1S

Renesas Electronics Corporation
Part No. UPA2816T1S
Description P-channel MOSFET ?0 V, ?7 A, 15.5 mΩ

File Size 137.11K  /  7 Page

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Amphenol Communications Solutions

Part No. 10150526-1011HLF
Description 2.0MM WIRE TO BOARD HEADER
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    SAMSUNG[Samsung semiconductor]
Part No. K1S2816BCM-I K1S2816BCM
Description 8Mx16 bit Page Mode Uni-Transistor Random Access Memory

File Size 132.33K  /  10 Page

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Amphenol Communications Solutions

Part No. 85261-001LF
Description Din Accessory Locking Frame 3x16
Tech specs    

Official Product Page

    K4M281633F K4M281633F-C K4M281633F-F1L K4M281633F-G K4M281633F-L K4M281633F-N K4M281633F-RE

Samsung Electronic
SAMSUNG[Samsung semiconductor]
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4M281633F K4M281633F-C K4M281633F-F1L K4M281633F-G K4M281633F-L K4M281633F-N K4M281633F-RE
Description 2M x 16Bit x 4 Banks Mobile SDRAM in 54FBGA 200万16 × 4银行54FBGA移动SDRAM

File Size 111.99K  /  12 Page

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Amphenol Communications Solutions

Part No. 54122-816523000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 52 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    44428-1604 SD-44428-001 0444281604

Molex Electronics Ltd.
http://
Part No. 44428-1604 SD-44428-001 0444281604
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, without

File Size 232.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 54112-816122500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Samsung Electronic
Part No. K4S28163LD-RFR
Description 2M x 16Bit x 4 Banks SDRAM in 54CSP Data Sheet

File Size 97.04K  /  12 Page

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Amphenol Communications Solutions

Part No. 59112-G28-16-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 32 Positions.
Tech specs    

Official Product Page

    KFG2816Q1M-DEB

Samsung semiconductor
Part No. KFG2816Q1M-DEB
Description (KFG2816Q1M-DEB / KFG2816U1M-DIB) Flash Memory

File Size 1,280.65K  /  88 Page

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Amphenol Communications Solutions

Part No. 54122-128161250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    EVAL-ADN2816EBZ

Analog Devices
Part No. EVAL-ADN2816EBZ
Description Continuous Rate 10 Mb/s to 675 Mb/s Clock and Data Recovery IC

File Size 390.57K  /  24 Page

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Amphenol Communications Solutions

Part No. 77315-428-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    42820 42817 42818 42815 42816 43914 43915 43938 43980

Molex Electronics Ltd.
Part No. 42820 42817 42818 42815 42816 43914 43915 43938 43980
Description 10.00mm (.393") Pitch Mini-Fit, Sr.垄芒
10.00mm (.393) Pitch Mini-Fit, Sr.?/a>

File Size 153.37K  /  2 Page

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Amphenol Communications Solutions

Part No. 68682-816
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Dual Entry, Double Row, 32 Position ,2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Samsung Electronics Inc
Part No. K4S281632F-TC75
Description DRAM (Dynamic RAM) - Datasheet Reference

File Size 107.60K  /  10 Page

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Amphenol Communications Solutions

Part No. 59202-S28-16-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 32 Positions.
Tech specs    

Official Product Page

    K4S281633D-N1H K4S281633D-N1L K4S281633D-N75 K4S281633D-RL

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S281633D-N1H K4S281633D-N1L K4S281633D-N75 K4S281633D-RL
Description IC REG ULDO DUAL 2.8/1.5V 6-MLF
8Mx16 SDRAM 54CSP
2M x 16Bit x 4 Banks SDRAM in 54CSP Data Sheet

File Size 66.22K  /  10 Page

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Amphenol Communications Solutions

Part No. 54122-816442250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 44 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For 52610-2816 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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