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Micross Components
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| Part No. |
HMC258
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| OCR Text |
... via 0.025 mm (1 mil) diameter wire bonds of minimal length <0.31 mm (<12 mils). gaas mmic sub-harmonically pumped mixer, 14 - 21 ghz para...bond length to the capacitor should be as short as possible. the ground side of the capacitor shoul... |
| Description |
Microwave Point-to-Point Radios
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| File Size |
905.75K /
9 Page |
 View
it Online |
Download Datasheet
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FAIRCHILD[Fairchild Semiconductor]
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| Part No. |
RMDA20420
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| OCR Text |
...m x 760m x 50m)
10,000 pF BOND WIRE Ls
DRAIN SUPPLY (Vd) (Connect to both Vd1 & Vd3) 100 pF
MMIC Chip
Vd1 Vg2 alt Vd2 Vd3 Vd4
RF IN
RF OUT
Vg1
Vg2
Vg3
Vg4
GROUND (Back of Chip) Note: The Input does not have a DC... |
| Description |
20 - 42 GHz General Purpose MMIC Amplifier
20-42 GHz Broadband Driver Amplifier
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| File Size |
815.25K /
12 Page |
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it Online |
Download Datasheet |
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RAYTHEON[Raytheon Company]
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| Part No. |
RMDA25000
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| OCR Text |
...ding straps. All die attach and wire/ribbon bond equipment must be well grounded to prevent static discharges through the device. Recommended wire bonding uses 3 mils wide and 0.5 mil thick gold ribbon with lengths as short as practical all... |
| Description |
23-28 GHz Driver Amplifier MMIC
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| File Size |
315.17K /
6 Page |
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it Online |
Download Datasheet |
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FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
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| Part No. |
RMDA29000
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| OCR Text |
...ding straps. All die attach and wire/ribbon bond equipment must be well grounded to prevent static discharges through the device. Recommended wire bonding uses 3 mils wide and 0.5 mil thick gold ribbon with lengths as short as practical all... |
| Description |
29 GHz Driver Amplifier
27-31 GHz Drive Amplifier MMIC
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| File Size |
113.05K /
8 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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