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SGS Thomson Microelectronics
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| Part No. |
AN1233
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| OCR Text |
...mmended mounting technique even though clamping can also be used. the backside of the package must be directly soldered to the heatsink. (see figure 4 for the flangeless package).
an1233 - application notean1232 - app 3/4 solder (pbsn) he... |
| Description |
LDMOS PACKAGES
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| File Size |
86.81K /
4 Page |
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it Online |
Download Datasheet
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SGS Thomson Microelectronics
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| Part No. |
AN627
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| OCR Text |
...t24xy21 in the dcc1 mode first, though, the device passes through an initial, internal, synchronization sequence, as depicted in figure 3. vclk is given nine free clock cycles, during which the sda pin is held in its high impedance state. o... |
| Description |
SERIAL EEPROM COMPATIBLE WITH PLUG-AND-PLAY VESA DISPLAY DATA CHANNEL (VERSIONS 1.0 AND 2.0)
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| File Size |
97.59K /
14 Page |
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it Online |
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Micronas Semiconductor Holding AG
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| Part No. |
CCU3000-I CCU3001-I
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| OCR Text |
...rdware emulation possible, even though the status and control lines of the internal cpu are not accessible. if an exter- nal processor is used, all hardware blocks of the chip are as accessible to it as if it were the internal cpu. 2.4. cl... |
| Description |
Central Control Unit MICROCONTROLLER, PQCC68
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| File Size |
854.51K /
77 Page |
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it Online |
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Tripath
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| Part No. |
RB-TK2150
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| OCR Text |
... not optimized for bridge mode. though the TK2150 is capable of supporting 400W-500W, bridged into 8, the RB-TK2150 is not thermally optimized for full power, bridged mode testing. Also, the externally controlled current limit is optimized ... |
| Description |
Reference Board
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| File Size |
1,769.83K /
33 Page |
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it Online |
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Price and Availability
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