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    STPS1L30

STMicroelectronics
Part No. STPS1L30
OCR Text ...nt versus pulse duration (epoxy printed circuit board, e(Cu)=35m, recommended pad layout) (SMB). Zth(j-a)/Rth(j-a) 1.0 0.8 0.6 0.4 T Fig. 6-2: Relative variation of thermal impedance junction to ambient versus pulse duration (epoxy pri...
Description LOW DROP POWER SCHOTTKY RECTIFIER

File Size 69.63K  /  6 Page

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    TDA1555 TDA1555Q

Philips Semiconductors
Part No. TDA1555 TDA1555Q
OCR Text ...ted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This ...
Description 4 x 11 W single-ended or 2 x 22 W power amplifier with distortion detector

File Size 96.27K  /  11 Page

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    TDA4820T

NXP Semiconductors
Philips Semiconductors
Part No. TDA4820T
OCR Text ...ted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This ...
Description Sync separation circuit for video applications

File Size 57.26K  /  10 Page

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    74LVC1G04 74LVC1G04GW

Philips Semiconductors
Part No. 74LVC1G04 74LVC1G04GW
OCR Text ...ing agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a ...
Description Single inverter

File Size 63.19K  /  12 Page

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    BLF861A BLF861A-2015

Quanzhou Jinmei Electronic ...
PHILIPS[Philips Semiconductors]
NXP Semiconductors N.V.
Part No. BLF861A BLF861A-2015
OCR Text ...nes are on a double copper-clad printed-circuit board: Rogers 5880 (r = 2.2); thickness 0.79 mm. 2001 Feb 09 8 Philips Semiconductors Product specification UHF power LDMOS transistor BLF861A handbook, full pagewidth ...
Description UHF power LDMOS transistor

File Size 109.61K  /  16 Page

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    STTH4R02FP STTH4R02 STTH4R02B-TR STTH4R02RL 4R2U 4R2S STTH4R02S STTH4R02U STTH4R02D

STMicroelectronics N.V.
意法半导
Part No. STTH4R02FP STTH4R02 STTH4R02B-TR STTH4R02RL 4R2U 4R2S STTH4R02S STTH4R02U STTH4R02D
OCR Text ...surface under tab - DPAK (Epoxy printed circuit board FR4, eCU = 35 m) Rth(j-a) (C/W) 100 90 80 DPAK QRR; IRM [T j] / Q RR; IRM [T j=125C] 1.4 1.2 1.0 0.8 0.6 QRR IRM IF=4A VR=160V 70 60 50 40 30 20 0.4 0.2 Tj(C) 0.0 25 50 75 ...
Description Ultrafast recovery diode 超快恢复二极

File Size 122.87K  /  13 Page

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    TDA4510

NXP Semiconductors
PHILIPS[Philips Semiconductors]
Part No. TDA4510
OCR Text ...ted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This ...
Description PAL decoder

File Size 69.81K  /  9 Page

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