H102 pdf Datasheet P13 Part Num --- IC-ON-LINE


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H102 Datasheet PDF File

For H102 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |

					TDK Electronics
Part No.	C1005X5R1H102M050BA-17
Description	Multilayer Ceramic Chip Capacitors
File Size	225.35K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G881H1022CEU
Description	Micro Power 3.0 Connector System - G881 Series, Wire to Board connector, , Housing, Dual Row, 10 positions , Ny66, Black, BAG
Tech specs				Official Product Page

HUA FENG CIRCUIT

					TDK Electronics
Part No.	C1005X5R1H102K050BA
Description	Commercial Grade ( General (Up to 50V) )
File Size	130.71K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G881H1021C3HR
Description	Micro Power 3.0 Connector System - G881 Series, Wire to Board connector, , Housing, Single Row, 10 positions , Ny66, Black, BAG
Tech specs				Official Product Page

					TDK Electronics
Part No.	C1005X5R1H102K050BA-17
Description	Multilayer Ceramic Chip Capacitors
File Size	225.36K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G88MPH1022AEU
Description	Micro Power Plus, Housing, Dual row, 3.0mm pitch, 10 positions, Ny66, Black, BAG
Tech specs				Official Product Page

					TDK Electronics
Part No.	C1005X7R1H102K050BE
Description	Multilayer Ceramic Chip Capacitors
File Size	231.73K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G88MPSH1022HR
Description	MICRO POWER Super 3.0MM
Tech specs				Official Product Page

					TDK Electronics
Part No.	C1005X7R1H102K050BA-17
Description	Multilayer Ceramic Chip Capacitors
File Size	227.44K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G862AH102T4EU
Description	G862 SERIES, SOCKET, 2.0mm PITCH, CRIMPING TYPE, 2x5Pin, NY66, BLACK
Tech specs				Official Product Page

					TDK Electronics
Part No.	C1005X7R1H102M050BE
Description	Multilayer Ceramic Chip Capacitors
File Size	231.75K / 3 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G862AH102T3EU
Description	G862 Series , 2.0mm Pitch , Cable end Contact Crimping Type , 1x4Pin , NY66
Tech specs				Official Product Page

					TDK Electronics
Part No.	C1608X7R1H102M080AE
Description	Multilayer Ceramic Chip Capacitors
File Size	130.78K / 1 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	G862H102T3HR
Description	Socket 2.00mm Pitch, CRIPMING TYPE, 1x10PIN, NY66, HF, NATURAL
Tech specs				Official Product Page

					TDK Electronics
Part No.	C2012C0G1H102K060AA-16
Description	Multilayer Ceramic Chip Capacitors
File Size	123.30K / 1 Page	View it Online	Download Datasheet

					TDK Electronics
Part No.	C1005X7R1H102K050BA-16
Description	Multilayer Ceramic Chip Capacitors
File Size	130.79K / 1 Page	View it Online	Download Datasheet

					TDK Electronics
Part No.	C1608X7R1H102K080AE
Description	Multilayer Ceramic Chip Capacitors
File Size	130.78K / 1 Page	View it Online	Download Datasheet

For H102 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |

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Part: H10223

Maker: SIEMENS

Pack: SMD14

Stock: 195

Unit price for :

50: $0.74

100: $0.70

1000: $0.66

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