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FILTRONIC[Filtronic Compound Semiconductors]
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| Part No. |
FMS2018
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| OCR Text |
...
FMS2018
GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible. The back of the die is not metallised and the recommended mounting method is by the use of conductive e... |
| Description |
SP7T GaAs Multi-Band GSM UMTS Antenna Switch
SP7T GaAs Multi-Band GSM - UMTS Antenna Switch
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| File Size |
328.37K /
5 Page |
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it Online |
Download Datasheet
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC341
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| OCR Text |
...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conduct... |
| Description |
GaAs MMIC LOW NOISE AMPLIFIER/ 24 - 30 GHz
GaAs MMIC LOW NOISE AMPLIFIER, 24 - 30 GHz
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| File Size |
181.84K /
6 Page |
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it Online |
Download Datasheet |
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC342 -HMC342
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| OCR Text |
...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conduct... |
| Description |
GaAs MMIC LOW NOISE AMPLIFIER/ 13 - 25 GHz
GaAs MMIC LOW NOISE AMPLIFIER, 13 - 25 GHz
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| File Size |
185.16K /
6 Page |
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it Online |
Download Datasheet |
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美国讯泰微波有限公司上海代表
HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC344
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| OCR Text |
...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conduct... |
| Description |
GaAs MMIC SP4T NON-REFLECTIVE SWITCH, DC - 8.0 GHz
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| File Size |
163.87K /
6 Page |
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it Online |
Download Datasheet |
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Hittite Microwave Corpo...
HITTITE[Hittite Microwave Corporation]
美国讯泰微波有限公司上海代表
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| Part No. |
HMC362
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| OCR Text |
...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conduct... |
| Description |
GaAs HBT MMIC DIVIDE-BY-4, DC - 11.0 GHz
600,000 SYSTEM GATE 1.8 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
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| File Size |
184.38K /
6 Page |
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it Online |
Download Datasheet |
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC405
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| OCR Text |
...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conduct... |
| Description |
InGaP HBT GAIN BLOCK MMIC AMPLIFIER, DC - 10.0 GHz
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| File Size |
210.47K /
6 Page |
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it Online |
Download Datasheet |
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC448
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| OCR Text |
...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conduct... |
| Description |
GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 19 - 25 GHz OUTPUT
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| File Size |
222.03K /
6 Page |
View
it Online |
Download Datasheet |
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC449
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| OCR Text |
...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conduct... |
| Description |
GaAs MMIC x2 ACTIVE FREQUENCY MULTIPLIER, 27 - 33 GHz OUTPUT
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| File Size |
221.78K /
6 Page |
View
it Online |
Download Datasheet |
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC606
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| OCR Text |
...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conduct... |
| Description |
GaAs InGaP HBT MMIC ULTRA LOW PHASE NOISE, DISTRIBUTED AMPLIFIER, 2 - 18 GHz
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| File Size |
385.85K /
6 Page |
View
it Online |
Download Datasheet |
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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC647
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| OCR Text |
...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with electrically conductive epoxy. The mounting surface... |
| Description |
GaAs MMIC 6-BIT DIGITAL PHASE SHIFTER, 2.5 - 3.1 GHz
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| File Size |
244.50K /
8 Page |
View
it Online |
Download Datasheet |
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