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bonded-pair Datasheet PDF File

For bonded-pair Found Datasheets File :: 393 Search Time::3.343ms
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				Hittite Microwave Corporation
Part No.	HMC51809
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. dc bonds of 0.001 (0.025 mm) diameter, thermosonically bonded, are recommended. ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. ...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 20 - 32 GHz
File Size	257.20K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH244
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs HEMT MMIC LOW NOISE AMPLIFIER, 24 - 40 GHz
File Size	182.30K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH3761
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs HEMT MMIC LOW NOISE AMPLIFIER, 35 - 45 GHz
File Size	169.53K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-APH462
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs HEMT MMIC 1 WATT POWER AMPLIFIER, 15 - 27 GHz
File Size	232.68K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH445
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs HEMT MMIC LOW NOISE AMPLIFIER, 18 - 40 GHz
File Size	240.84K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ABH2410712
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 50 - 66 GHz
File Size	216.97K / 6 Page	View it Online	Download Datasheet

				Pasternack Enterprises, Inc.
Part No.	LMR-200
OCR Text	... a pvc jacket and un-bonded aluminum tape to facilitate end stripping with automated equipment. ? low loss ...pair tc-200-bm tc-200-muhf ez-200-nmh-d tc-200-nm tc-200-nm-rp tc-200-sm tc-200-sm-rp ez-200-tm tc-2...
Description	Flexible Low Loss Communications Coax
File Size	216.71K / 4 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ABH209
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 55 - 65 GHz
File Size	181.58K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corpo...
Part No.	HMC-ABH241
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. dc bonds of 0.001 (0.025 mm) diameter, thermosonically bonded, are recommended. ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. ...
Description	GaAs HEMT MMIC MEDIUM POWER AMPLIFIER, 50 - 66 GHz
File Size	217.63K / 6 Page	View it Online	Download Datasheet

For bonded-pair Found Datasheets File :: 393 Search Time::3.343ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |