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Amphenol Communications Solutions |
Part No. |
10007607-802-06LF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled header ,Through Hole, Row Polarized ,Double row , 6 Positions ,2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0780350001 78035-0001
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Description |
0.60mm (.024") Pitch miniDIMM DDR2 Socket, Surface Mount, 22.5掳 Reverse Angle,0.76渭m (30渭") Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 244 0.60mm (.024) Pitch miniDIMM DDR2 Socket, Surface Mount, 22.5° Reverse Angle,0.76μm (30μ) Gold (Au) Plating, Off-White Latches, with Pick-and-Place Cap, 244
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File Size |
477.35K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10007607-802-36LF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled header ,Through Hole, Row Polarized ,Double row , 36 Positions ,2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0780790052 78079-0052
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Description |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38渭m (15渭) Gold(Au) Plating 1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38μm (15μ) Gold(Au) Plating
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File Size |
809.49K /
10 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10007607-801-36LF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled header ,Through Hole, Row Polarized ,Double row , 36 Positions ,2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0780790051 78079-0051
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Description |
1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38渭m (15渭") Gold(Au) Plating 1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Black Housing, Off-White Latches, 0.38μm (15μ) Gold(Au) Plating
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File Size |
809.47K /
10 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10007607-801-06LF
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Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Right Angled header ,Through Hole, Row Polarized ,Double row , 6 Positions ,2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
HS30780081
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Description |
Backplane connectors,cable backplane ,Paladin 4X8 Cable, 30 AWG, 25 GHz
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Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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Part No. |
0780790101 78079-0101
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Description |
1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Off-White Housing and Latches, 0.38渭m (15渭) Gold (Au) Plating 1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Off-White Housing and Latches, 0.38μm (15μ) Gold (Au) Plating
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File Size |
1,591.81K /
18 Page |
View
it Online |
Download Datasheet
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Bom2Buy.com

Price and Availability
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