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Amphenol Communications Solutions |
| Part No. |
91276-434HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54mm Pitch, Vertical, 22.86mm (0.9in) Mating, 5.72mm (0.225in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713085410 71308-5410
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 10 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 10 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
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| File Size |
1,475.56K /
8 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
86964-345LF
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| Description |
<span style=\\background-color: #FFFF00\\><b>PREFERRED P/N SERIES FOR NEW PROJECT: 57102</b></span><br><br>Minitek® 2.00mm, Board to Board, Unshrouded Vertical Header, Through Hole, Double Row, 20 Positions, 2.00mm (0.079in) Pitch..
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87606-434LF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Top Entry, 68 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
87916-434HLF
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| Description |
BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54mm Pitch, Vertical, 21.08mm (0.83in) Mating, 3.25mm (0.128in) Tail.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713085420 71308-5420
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 20 Circuits1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB L
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 20 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
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| File Size |
1,475.56K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68466-434HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch, Vertical, 17.7 mm (0.697 in.) Mating, 3.25 mm (0.128 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10135583-643402LF
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| Description |
Bergstak® 0.80mm Pitch, Board to Board Vertical Receptacle, Dual Row, 64 Positions, 0.80mm (0.031in) Pitch.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
67996-434HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 34 Positions, 2.54 mm (0.100in) Pitch
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713086478
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| Description |
2.54mm (.100) Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 78 Circuits, 1.50μm (59u) Minimum
2.54mm (.100") Pitch C-Grid Header, Surface Mount, Dual Row, Vertical, 78 Circuits, 1.50楼矛m (59u") Minimum
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| File Size |
1,475.71K /
8 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68016-434HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 34 Positions, 2.54 mm (0.100) Pitch.
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0713085416 71308-5416
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| Description |
2.54mm (.100") Pitch C-Grid庐 Header, Surface Mount, Dual Row, Vertical, 16 Circuits,1.50渭m (59渭") Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB
2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 16 Circuits,1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator
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| File Size |
1,475.55K /
8 Page |
View
it Online |
Download Datasheet |
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