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  52610-2816 Datasheet PDF File

For 52610-2816 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    0511281601 51128-1601

Molex Electronics Ltd.
Part No. 0511281601 51128-1601
Description 2.50mm (.098") / 3.00mm (.118") Pitch Wire-to-Board Receptacle Housing with Fuse16 Circuits
2.50mm (.098) / 3.00mm (.118) Pitch Wire-to-Board Receptacle Housing with Fuse16 Circuits

File Size 89.45K  /  2 Page

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Amphenol Communications Solutions

Part No. 10150526-1011HLF
Description 2.0MM WIRE TO BOARD HEADER
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87914-2816 0879142816

Molex Electronics Ltd.
Part No. 87914-2816 0879142816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.54K  /  48 Page

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Amphenol Communications Solutions

Part No. 85261-001LF
Description Din Accessory Locking Frame 3x16
Tech specs    

Official Product Page

    87760-2816 0877602816

Molex Electronics Ltd.
Part No. 87760-2816 0877602816
Description 2.00mm (.079) Pitch Milli-Grid Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free
2.00mm (.079) Pitch Milli-Grid?/a> Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray, Lead-free

File Size 160.34K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-816523000LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 52 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    Samsung
Part No. K4S281632K
Description 128Mb K-die SDRAM

File Size 251.68K  /  14 Page

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Amphenol Communications Solutions

Part No. 54112-816122500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    K4S281632K

Samsung semiconductor
Part No. K4S281632K
Description 128Mb K-die SDRAM Specification

File Size 271.10K  /  15 Page

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Amphenol Communications Solutions

Part No. 59112-G28-16-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 32 Positions.
Tech specs    

Official Product Page

    Samsung Electronic
Part No. K4H281638D
Description 128Mb DDR SDRAM Data Sheet

File Size 317.02K  /  51 Page

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Amphenol Communications Solutions

Part No. 54122-128161250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 16 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    K4M28163PH

Samsung semiconductor
Part No. K4M28163PH
Description 2M x 16Bit x 4 Banks Mobile SDRAM

File Size 140.49K  /  12 Page

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Amphenol Communications Solutions

Part No. 77315-428-16LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    HMN12816D-85I HMN12816D HMN12816D-120 HMN12816D-120I HMN12816D-150 HMN12816D-150I HMN12816D-70 HMN12816D-70I HMN12816D-8

Electronic Theatre Controls, Inc.
Hanbit Electronics Co.,Ltd
ETC[ETC]
List of Unclassifed Manufacturers
Part No. HMN12816D-85I HMN12816D HMN12816D-120 HMN12816D-120I HMN12816D-150 HMN12816D-150I HMN12816D-70 HMN12816D-70I HMN12816D-85
Description Non-Volatile SRAM MODULE 2Mbit (128K x 16-Bit), 40pin-Dip, 5V 非易失性SRAM模块即可移植28K的x 16位)0pin浸,5V

File Size 143.52K  /  9 Page

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Amphenol Communications Solutions

Part No. 68682-816
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Dual Entry, Double Row, 32 Position ,2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    44428-1603 0444281603

Molex Electronics Ltd.
Part No. 44428-1603 0444281603
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 232.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 59202-S28-16-050LF
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 32 Positions.
Tech specs    

Official Product Page

    44428-1605 0444281605

Molex Electronics Ltd.
Part No. 44428-1605 0444281605
Description 3.00mm (.118) Pitch Micro-Fit 3.0 BMI?/a> Header, Surface Mount Compatible, DualRow, Right Angle, without Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 BMI Header, Surface Mount Compatible, DualRow, Right Angle, without Snap-in Plastic Peg PCB Lock, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 232.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 54122-816442250LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 44 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

For 52610-2816 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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