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wire-bond Datasheet PDF File

For wire-bond Found Datasheets File :: 3398 Search Time::2.187ms
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				Hittite Microwave Corporation Hittite Microwave Corpo...
Part No.	HMC-ALH44410
OCR Text	...ible in order to minimize bond wire length. typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). handling precautions follow these precautions to avoid permanent damage. storage: all bare die are placed in either waff...
Description	GaAs HEMT MMIC LOW NOISE AMPLIFIER, 1 - 12 GHz
File Size	194.88K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH50810
OCR Text	...ocompression and thermosonic wire bonding, making it ideal for m c m and hybrid microcircuit applications. all data shown ...bond wire length. typical die-to-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). ha...
Description	GaAs HEMT LOW NOISE AMPLIFIER, 71 - 86 GHz
File Size	267.17K / 6 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC346
OCR Text	...sible in order to minimize bond wire length. Typical die-tosubstrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 2-6 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chelmsf...
Description	GaAs MMIC VOLTAGE-VARIABLE ATTENUATOR DC - 20 GHz GaAs MMIC VOLTAGE-VARIABLE ATTENUATOR, DC - 20 GHz
File Size	242.04K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-MDB277
OCR Text	...ermocompression and thermosonic wire bonding, making it ideal for mcm and hybrid microcircuit applications. this compact mmic is a much s...bond pad is .004 square. 3. backside metallization: gold. 4. backside metal is ground. 5. bond pa...
Description	GaAs MMIC FUNDAMENTAL MIXER, 70 - 90 GHz
File Size	149.91K / 4 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC24010
OCR Text	...d via 0.025 mm (1 mil) diameter wire bonds of 0.31 mm (12 mils) length. broadband performance: dc - 4 ghz low insertion loss: 0.5 db @ 2 g...bond pad is 0.004 square. 4. typical bond pad spacing is 0.006 center to center. 5. bond pad metal...
Description	GaAs MMIC SPDT SWITCH DC - 4 GHz
File Size	148.73K / 6 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	PCF2120 PCF2120TK PCF2120U
OCR Text	...0.85 mm sot650-1 pcf2120u [1] - wire bond die; 7 bonding pads; 0.57 1.1 0.2 mm pcf2120u pin numbers shown for hsvon10 package. fig 1. block diagram 001aaf631 test v ss v dd osco osci clkout n.c. clkoe 10 3 2 5 79 8 1, 4, 6 c l(itg) pcf212...
Description	Quartz oscillator
File Size	69.20K / 14 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC347
OCR Text	...sible in order to minimize bond wire length. Typical dieto-substrate spacing is 0.076mm to 0.152 mm (3 to 6 mils). 7 - 30 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 12 Elizabeth Drive, Chel...
Description	GaAs MMIC SPDT NON-REFLECTIVE SWITCH/ DC - 20.0 GHz GaAs MMIC SPDT NON-REFLECTIVE SWITCH, DC - 20.0 GHz GaAs MMIC SPDT NON-REFLECTIVE SWITCH DC - 20.0 GHz
File Size	159.33K / 6 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 HITTITE[Hittite Microwave Corporation]
Part No.	HMC442
OCR Text	...ed via 0.025mm (1 mil) diameter wire bonds of minimal length 0.31mm (12 mils). Electrical Specifications, TA = +25 C, Vdd = 5V, Idd = 85 ...BOND IS .004" SQUARE 4. BACKSIDE METALLIZATION: GOLD 5. BOND PAD METALLIZATION: GOLD 6. BACKSIDE MET...
Description	800000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 17.5 - 25.5 GHz
File Size	229.64K / 8 Page	View it Online	Download Datasheet

				Excelics Semiconductor
Part No.	EMA302B
OCR Text	...f .7 mil to 1 mil diameter gold wire is recommended. the ema302b is partially input matched. some input match and the output match must ...bond wire inductance will form part of the matching network, so bond wire lengths must be controlle...
Description	22-26 GHz medium power MMIC
File Size	85.33K / 4 Page	View it Online	Download Datasheet

				Motorola
Part No.	MPX2100
OCR Text	...ential SILICONE GEL DIE COAT WIRE BOND LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT P2 DIE BOND LEAD FRAME Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (right) and t...
Description	MPX2100 100 kPa On-Chip Temperature Compensated and Calibrated Silicon Pressure Sensors 100 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors
File Size	127.95K / 8 Page	View it Online	Download Datasheet

For wire-bond Found Datasheets File :: 3398 Search Time::2.187ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |