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  stencil Datasheet PDF File

For stencil Found Datasheets File :: 1989    Search Time::2.844ms    
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    ST Microelectronics
Part No. EMIF10-1K010F2
OCR Text ...ecommended , 300m max Solder stencil opening : 330m Dot, ST logo xx = marking z = packaging location yww = datecode (y = year ww = week) 545 E Solder mask opening recommendation : 340m min for 315m copper pad diameter xxz y ...
Description EMI FILTER INCLUDING ESD PROTECTION

File Size 102.81K  /  7 Page

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    EMIF10-1K010 7253

STMicroelectronics
Part No. EMIF10-1K010 7253
OCR Text ...ecommended , 300m max Solder stencil opening : 330m Solder mask opening recommendation : 340m min for 315m copper pad diameter MARKING Dot, ST logo xxx = marking yww = datecode (y = year ww = week) 545 545 400 xxx y ww ...
Description EMI FILTER INCLUDING ESD PROTECTION
From old datasheet system

File Size 151.04K  /  6 Page

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    EMIF10-COM01F2 EMIF010-COM01F2 EMIF10-COX01F2 EMIF10-COZ01F2 EMIF10-COX01F1 EMIF10-COX01F3 EMIF10-COZ01F1 EMIF10-COZ01F3

STMicroelectronics N.V.
意法半导
ST Microelectronics
Part No. EMIF10-COM01F2 EMIF010-COM01F2 EMIF10-COX01F2 EMIF10-COZ01F2 EMIF10-COX01F1 EMIF10-COX01F3 EMIF10-COZ01F1 EMIF10-COZ01F3
OCR Text ...ended , 300m max E Solder stencil opening : 330m Solder mask opening recommendation : 340m min for 315m copper pad diameter xxz y ww 100 230 All dimensions in m 5/7 EMIF10-COM01F2 Figure 14: FLIP-CHIP Tape and Re...
Description EMI FILTER INCLUDING ESD PROTECTION EMI滤波器包括静电放电保

File Size 113.48K  /  7 Page

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    HMC283LM1

HITTITE[Hittite Microwave Corporation]
Part No. HMC283LM1
OCR Text ...plied to the PCB using either a stencil printer or dot placement. The volume of solder paste will be dependent on PCB and component layout and should be controlled to ensure consistent mechanical & electrical performance. Excess solder may ...
Description SMT MEDIUM POWER GaAs MMIC AMPLIFIER, 17 - 40 GHz

File Size 358.78K  /  8 Page

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    RT1710B6 RT1720B7 RT1721B7 RT1723B6 RT1723B7 RT1725B7 RT1710B7 RT1722B7 RT2724B7 RT1721B6 RT1724B7 RT1725B6 RT2720B7 RT2

CTS[CTS Corporation]
Part No. RT1710B6 RT1720B7 RT1721B7 RT1723B6 RT1723B7 RT1725B7 RT1710B7 RT1722B7 RT2724B7 RT1721B6 RT1724B7 RT1725B6 RT2720B7 RT2721B6 RT2721B7 RT2722B7 RT2723B6 RT2723B7 RT2725B6 RT2725B7 RT2710B7 RT2710B6 RT2723B6TR13 RT2723B6TR7 RT2723B7TR13 RT2723B7TR7 RT1710B6TR13 RT1710B6TR7 RT1710B7TR13 RT1710B7TR7 RT1720B7TR13 RT1720B7TR7 RT1721B6TR13 RT1721B6TR7 RT1721B7TR13 RT1721B7TR7 RT2728B7 RT2728B7TR13 RT2728B7TR7 RT2727B6 RT2727B6TR13 RT2727B6TR7 RT2729B6 RT2729B6TR13 RT2729B6TR7 RT1725B7TR13 RT2725B7TR13 RT1725B7TR7 RT2725B7TR7 RT2726B7 RT2726B7TR13 RT2726B7TR7 RT1723B7TR13 RT1723B7TR7 RT1723B6TR13 RT1723B6TR7 RT1729B6 RT1729B6TR13 RT1729B6TR7 RT1729B7 RT1729B7TR13 RT1729B7TR7 RT1726B7 RT1726B7TR13 RT1726B7TR7 RT2710B6TR13 RT2710B6TR7 RT2710B7TR13 RT2710B7TR7 RT1724B7TR13 RT2724B7TR13 RT1724B7TR7 RT2724B7TR7 RT1725B6TR13 RT2725B6TR13 RT1725B6TR7 RT2725B6TR7 RT2721B6TR13 RT2721B6TR7 RT1728B7 RT1728B7TR13 RT1728B7TR7 RT2720B7TR13 RT2720B7TR7 RT2721B7TR7 RT2722B7TR7 RT2721B7TR13 RT2722B7TR13
OCR Text ... For .006" Thick Solder Paste stencil, Aperture Opening Should be Equal to the PCB Pad Diameter. Refer to www.ctscorp.com/components/clearone.asp for additional PCB design information Mechanical Diagram L H W RT_7__B_ CTS YRWK ...
Description    LVDS & LVPECL FPGA Terminator RoHS Compliant Parts Available

File Size 74.81K  /  2 Page

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    HMC6052

Electronic Theatre Controls, Inc.
List of Unclassifed Manufacturers
ETC
Honeywell Sensing
Part No. HMC6052
OCR Text ...)/2 Mounting Considerations stencil Design and Solder Paste A 4 mil stencil and 100% paste coverage is recommended electrical contact pads. The HMC6052 has been tested successfully with no-clean solder paste. Pick and Place Placement is...
Description INTEGRATED COMPASS SENSOR

File Size 156.31K  /  6 Page

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    TGA2503-SM

TriQuint Semiconductor
Part No. TGA2503-SM
OCR Text ...er paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. Clean the assembly wi...
Description
File Size 144.86K  /  11 Page

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    TGA2513-SM

TriQuint Semiconductor
Part No. TGA2513-SM
OCR Text ...er paste can be applied using a stencil printer or dot placement. The volume of solder paste depends on PCB and component layout and should be well controlled to ensure consistent mechanical and electrical performance. Clean the assembly wi...
Description 2-20 GHz LNA with AGC

File Size 174.40K  /  10 Page

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    RT1300B6 RT2300B6 RT1300B6TR7 RT1300B6TR13 RT2300B6TR13

CTS Corporation
Part No. RT1300B6 RT2300B6 RT1300B6TR7 RT1300B6TR13 RT2300B6TR13
OCR Text ... For .006" Thick Solder Paste stencil, Aperture Opening Should be Equal to the PCB Pad Diameter. Refer to www.ctscorp.com/components/clearone.asp for additional PCB design information Mechanical Diagram L H W RT_300B6 CTS YRWK ...
Description LVD SCSI Terminator RoHS Compliant Parts Available

File Size 52.06K  /  2 Page

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    ACMD-7401 ACMD-7401-TR1 ACMD-7401-BLK

Agilent (Hewlett-Packard)
Agilent(Hewlett-Packard)
Part No. ACMD-7401 ACMD-7401-TR1 ACMD-7401-BLK
OCR Text ... design, and solder mask/solder stencil design. These four design areas, which are sometimes interrelated, will be considered one at a time below. Thermal Ground FBAR resonators have a negative temperature coefficient of frequency -- as tem...
Description MINIATURE PCS BAND DUPLEXER

File Size 302.35K  /  11 Page

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For stencil Found Datasheets File :: 1989    Search Time::2.844ms    
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