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For spreader Found Datasheets File :: 1067 Search Time::4.734ms
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				美国讯泰微波有限公司上海代表 HITTITE[Hittite Microwave Corporation]
Part No.	HMC464
OCR Text	...m (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical die-tosubstrate s...
Description	800000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN GaAs PHEMT MMIC POWER AMPLIFIER, 2.0 - 20.0 GHz
File Size	230.46K / 6 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 HITTITE[Hittite Microwave Corporation]
Part No.	HMC465
OCR Text	...m (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical dieto-substrate s...
Description	800000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN GaAs PHEMT MMIC MODULATOR DRIVER AMPLIFIER, DC - 20.0 GHz
File Size	285.41K / 8 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC490
OCR Text	...m (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical dieto-substrate s...
Description	GaAs PHEMT MMIC LOW NOISE HIGH IP3 AMPLIFIER/ 12 - 17 GHz GaAs PHEMT MMIC LOW NOISE HIGH IP3 AMPLIFIER, 12 - 17 GHz
File Size	214.90K / 8 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC498
OCR Text	...m (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical dieto-substrate s...
Description	GaAs PHEMT MMIC POWER AMPLIFIER/ 17 - 24 GHz GaAs PHEMT MMIC POWER AMPLIFIER, 17 - 24 GHz
File Size	207.55K / 8 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC499
OCR Text	...m (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical dieto-substrate s...
Description	GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 21 - 32 GHz
File Size	215.15K / 8 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	MBRA210ET3
OCR Text	...n. pads or 1 square copper heat spreader. 2. Pulse Test: Pulse Width 250 s, Duty Cycle 2%. 100 IF, INSTANTANEOUS FORWARD CURRENT (AMPS) 100 IF, MAXIMUM INSTANTANEOUS FORWARD CURRENT (AMPS) -40 C 0.5 0.6 0.7 10 10 100C 1 ...
Description	Surface Mount Schottky Power Rectifier
File Size	46.10K / 8 Page	View it Online	Download Datasheet

				http:// NEC[NEC] NEC Corp.
Part No.	MC-4R192CPE6C MC-4R192CPE6C-653 MC-4R192CPE6C-745 MC-4R192CPE6C-845
OCR Text	...e connector pads RIMM with heat spreader Edge connector : Gold plated 12 pieces of Package Mounted devices PD488448FF FBGA (BGA(R)) package 2 Preliminary Data Sheet M14808EJ2V0DS00 MC-4R192CPE6C Module Pad Configuration B1 ...
Description	Direct Rambus DRAM RIMM Module 192M-BYTE 96M-WORD x 16-BIT
File Size	130.93K / 16 Page	View it Online	Download Datasheet

				NEC
Part No.	UPD65949GD-XXX-LML
OCR Text	...stic QFP (fine-pitch, with heat spreader) * 48- to 120-pin plastic TQFP * 144-pin plastic LQFP * 225- to 352-pin plastic BGA * 108- to 304-pin plastic FBGA * 256- to 696-pin tape BGA (with heat spreader) Pamphlet A12852EJ3V0PF00 3 ...
Description	Channelless type CMOS gate array using 0.35um process
File Size	1,234.44K / 21 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC265
OCR Text	...m (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure 2). Microstrip substrates should be brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substra...
Description	GaAs MMIC SUB-HARMONICALLY PUMPED DOWNCONVERTER, 20 - 32 GHz GaAs MMIC SUB-HARMONICALLY PUMPED DOWNCONVERTER/ 20 - 32 GHz
File Size	217.48K / 6 Page	View it Online	Download Datasheet

For spreader Found Datasheets File :: 1067 Search Time::4.734ms
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