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  ni-barrier Datasheet PDF File

For ni-barrier Found Datasheets File :: 784    Search Time::1.093ms    
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    EPCOS AG
Part No. B37951J5224M072 B37942K5104M001 B37942J5104M001 B37942J5105M070 B37957K5105M001 B37951K5105M001 B37954J5104M001 B37954K5104M001 B37951J5105M001 B37957K5104M060 B37951J5224M070 B37951J5105M070 B37942J5105M062 B37942J5224M070 B37954K5104M060
OCR Text ...ng: nickel-barrier termination (ni) for case sizes 0603 to 1210 silver-palladium termination (agpd) for case sizes 1812 and 2220 delivery mode cardboard and blister tape (bliste r tape for chip thickness 1,2 0,1 mm and case sizes ...
Description Multilayer Ceramic Capacitors 多层陶瓷电容

File Size 123.04K  /  11 Page

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    TriQuint Semiconductor, Inc.
Part No. TGS4305-FC
OCR Text ...ld at pillar attach interface. ni is the adhesion layer for the solder and the gold keeps the ni from oxidizing . the au should be kept to...barrier must be applied or designed into the pad area of the board. the barrier must be suffici ent...
Description 60 - 90 GHz SP3T Switch Flip Chip 60000 MHz - 90000 MHz RF/MICROWAVE SGL POLE TRIPLE THROW SWITCH, 3.75 dB INSERTION LOSS

File Size 258.81K  /  11 Page

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    B37872

EPCOS
Part No. B37872
OCR Text ...s, nickel-barrier terminations (ni) options alternative capacitance val ues, capacitance tolerances, c0g characteristic and feedthrough arrays available on request delivery mode cardboard tape, 180-mm reel electrical data tempera...
Description Multilayer Ceramic Capacitors Array

File Size 119.36K  /  8 Page

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    TriQuint Semiconductor, Inc.
Part No. TGC4703-FC
OCR Text ...ld at pillar attach interface. ni is the adhesion layer for the solder and the gold keeps the ni from oxidizing . the au should be kept to...barrier must be applied or designed into the pad area of the board. the barrier must be suffici ent...
Description 19 to 38 GHz Doubler 19000 MHz - 19250 MHz RF/MICROWAVE FREQUENCY DOUBLER

File Size 336.95K  /  11 Page

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    TGC4702-FC TGC4702-FC-15

TriQuint Semiconductor
Part No. TGC4702-FC TGC4702-FC-15
OCR Text ...ld at pillar attach interface. ni is the adhesion layer for the solder and the gold keeps the ni from oxidizing . the au should be kept to...barrier must be applied or designed into the pad area of the board. the barrier must be suffici ent...
Description 77 GHz Down Converting IQ Mixer

File Size 235.18K  /  13 Page

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    B37637

EPCOS
Part No. B37637
OCR Text ...g: nickel-barrier terminations (ni) options alternative capacitance tole rances available on request delivery mode cardboard tape, 180-mm and 330-mm reel available note: production ramp up end of 2003, all capacitance values on request ...
Description (B376x7) Multilayer Ceramic Capacitors

File Size 122.26K  /  9 Page

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    B37932JXXX B37873JXXX B37873KXXX

EPCOS
Part No. B37932JXXX B37873JXXX B37873KXXX
OCR Text ...ng: nickel-barrier termination (ni) for case sizes 0603 to 1210 silver-palladium termination (agpd) for case sizes 1812 and 2220 delivery mode cardboard and blister tape (bliste r tape for chip thickness 1,2 0,1 mm and case sizes ...
Description Multilayer Ceramic Capacitors

File Size 150.69K  /  11 Page

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    B37937

EPCOS
Part No. B37937
OCR Text ...g: nickel-barrier terminations (ni) options alternative capacitance tole rances available on request delivery mode cardboard and blister tape (blister tape for chip thickness 1,2 0,1 mm), 180-mm and 330-mm reel available e...
Description (B37937 / B37947) Multilayer Ceramic Capacitors

File Size 124.79K  /  9 Page

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    Vishay Vitramon
Part No. VJ1825A103JXEAT VJ1825A123FXAAT VJ1825A153JXAAT VJ1825A223FXAAT VJ1825A223JXAAT VJ1825A103GXAAT VJ1825A103GXCAT VJ1825A103JXAMT
OCR Text ...? 10 pf x7r, x5r: j, k, m x = ni barrier 100 % tin plated l = ni barrier with tin lead plated finish min. 4 % lead f = agpd n = non-magnetic y = 6.3 v q = 10 v j = 16 v x = 25 v a = 50 v k = 75 v b = 100 v c = 200 v p = 250 v e =...
Description MULTILAYER CERAMIC CHIP CAPACITOR
CAP 0.012UF 50VDC C0G 1% SMD 1825 - Tape and Reel
CAP 0.015UF 50VDC C0G 5% SMD 1825 - Tape and Reel
Cap Ceramic 0.022uF 50V C0G 1% SMD 1825 150C Plastic T/R
CAP 0.022UF 50VDC C0G 5% SMD 1825 - Tape and Reel
CAP 0.01UF 50VDC C0G 2% SMD 1825 - Tape and Reel
VJ Hi-Rel Series Surface Mount Multilayer Ceramic Chip Capacitors for High Reliability Applications
CAPACITOR, CERAMIC, 50 V, C0G, 0.01 uF, SURFACE MOUNT, 1825, CHIP

File Size 170.37K  /  15 Page

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    EPCOS AG
Part No. X8R
OCR Text ...g: Nickel barrier terminations (Ni) Options Alternative capacitance tolerances available on request Delivery mode Cardboard and blister tape (blister tape for chip thickness 1.2 0.1 mm and case size 1210) 180-mm and 330-mm reel...
Description Multilayer ceramic capacitors Chip capacitors

File Size 110.15K  /  13 Page

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For ni-barrier Found Datasheets File :: 784    Search Time::1.093ms    
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