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HITTITE[Hittite Microwave Corporation]
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| Part No. |
HMC607
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| OCR Text |
...rs. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
0.127mm (0.005") Thick Alumina Thin Film Substrate Figure 1.
0.102mm (0.004") Thick GaAs MMIC
Wire Bond 0.076mm (... |
| Description |
GaAs MMIC HIGH ISOLATION SPDT SWITCH, DC - 15 GHz
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| File Size |
257.14K /
6 Page |
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it Online |
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http://
FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor Corporation
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| Part No. |
AN-5026
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| OCR Text |
...e larger pitch. 3. BGAs have no fragile leads, that causes yield and rework problems. 4. Board assembly yields are significantly improved. 5. Board inspection can be reduced. 6. BGAs have better thermal and electrical properties. 7. In many... |
| Description |
Using BGA Packages
Contact Gender:Pin; Circular Shell Style:Wall Mount Receptacle; Insert Arrangement:15-19 RoHS Compliant: No
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| File Size |
720.16K /
8 Page |
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it Online |
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SKYWORKS[Skyworks Solutions Inc.]
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| Part No. |
DSG9500-000
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| OCR Text |
...all size, beam-lead devices are fragile and should be handled with extreme care. The individual plastic packages should be handled and opened carefully, so that no undue mechanical strain is applied to the packaged device. It is recommended... |
| Description |
Planar Beam Lead PIN Diode
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| File Size |
68.53K /
5 Page |
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it Online |
Download Datasheet |
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FILTRONIC[Filtronic Compound Semiconductors]
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| Part No. |
FMS2016
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| OCR Text |
...Instructions:
GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible. The back of the die is not metallised and the recommended mounting method is by the use of conductive e... |
| Description |
SP4T GaAs Multi-Band GSM Antenna Switch
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| File Size |
143.76K /
4 Page |
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it Online |
Download Datasheet |
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