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  footprint- Datasheet PDF File

For footprint- Found Datasheets File :: 34718    Search Time::1.5ms    
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    SI3445DV-T1-E3

Vishay Siliconix
Part No. SI3445DV-T1-E3
OCR Text ...at has remained the same is the footprint of the packages. the basis of the pad design for surface mounted power mosfet is the basic footprint for the package. for the tsop-6 package outline drawing see http://www.vishay.com/doc?71200 a...
Description P-Channel 1.8-V (G-S) MOSFET

File Size 185.17K  /  9 Page

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    PESD1LVDS

NXP Semiconductors
Part No. PESD1LVDS
OCR Text ...method. fig 5. reflow soldering footprint sot1165-1 (xson10) sot1165-1 remark: stencil of 75 m is recommended. a stencil of 75 m gives an aspect ratio of 0.77 with a stencil of 100 m one will obtain an aspect ratio of 0.58 footprint informa...
Description ESD protection for in-vehicle ultra high-speed interfaces

File Size 401.05K  /  12 Page

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    BIM2EH-433-10 BIM2EH-433-64 BIM2H-433-10 BIM2H-433-64 BIM2A-433-10-CD-3V BIM2A-433-10-CD-5V BIM2A-433-64-CD-3V BIM2A-433

Radiometrix Ltd
Part No. BIM2EH-433-10 BIM2EH-433-64 BIM2H-433-10 BIM2H-433-64 BIM2A-433-10-CD-3V BIM2A-433-10-CD-5V BIM2A-433-64-CD-3V BIM2A-433-64-CD-5V BIM2A-433-10
OCR Text ...baseband Low profile with small footprint 33 x 23 x 5mm Conforms to European EN 301 489-3 and ETSI EN 300 220-3 (ERP @ 10mW) Conforms to Australian/New Zealand AS/NZS 4268:2003 (ERP @ 25mW) Instead of the SAW-based technology of the BiM2, t...
Description 433MHz Wide Band FM radio transceiver

File Size 212.44K  /  9 Page

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    CHX2090-QDG

United Monolithic Semiconductors
Part No. CHX2090-QDG
OCR Text ...ld be designed according to the footprint given above. The proper via structure under the ground pad is very important in order to achieve a good RF and lifetime performance. All tests have been done by using a grid of plenty plated through...
Description 12-24GHz Frequency Multiplier

File Size 319.74K  /  10 Page

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    CHX3068-QDG

United Monolithic Semiconductors
Part No. CHX3068-QDG
OCR Text ...HX3068-QDG Recommanded package footprint 15-30GHz Frequency Multiplier Refere to the application note AN0017 available at http://www.ums-gaas.com for package foot print recommandations. SMD mounting procedure The SMD leadless pac...
Description 15-30GHz Frequency Multiplier

File Size 346.17K  /  8 Page

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    ST Microelectronics
Part No. STH400N4F6-2
OCR Text ... figure 14. h2pak-2 recommended footprint (dimensions in mm) 8159712_c package mechanical data sth400n4f6-2, sth400n4f6-6 12/18 docid023429 rev 2 figure 15. h2pak-6 drawing 8159693_rev_f docid023429 rev 2 13/18 sth400n4f6-2, sth400n4f6-...
Description Automotive-grade N-channel 40 V, 0.85 mOhm typ., 180 A STripFET(TM) VI DeepGATE(TM) Power MOSFET in H2PAK-2 package

File Size 769.80K  /  18 Page

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    G952T23U G952T23UF G952T43U G952T43UF G952T24U G952T24UF G952T25U G952T25UF G952T63U G952T63UF G952T65U G952T65UF G95207

Global Mixed-mode Techn...
Global Mixed-mode Technology Inc
Part No. G952T23U G952T23UF G952T43U G952T43UF G952T24U G952T24UF G952T25U G952T25UF G952T63U G952T63UF G952T65U G952T65UF G95207
OCR Text ...te (1): See Recommended Minimum Footprint G952 Absolute Maximum Ratings Operating Conditions (Note 1) Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . .2.7V~6.5V Temperature Range. . . . . . . . . . . . . . -40C TA 85...
Description 1.8V 1A Regulator

File Size 425.56K  /  11 Page

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    74AHCT1G04 74AHCT1G04GW 74AHC1G04 74AHC1G04GW

Philips Semiconductors
Part No. 74AHCT1G04 74AHCT1G04GW 74AHC1G04 74AHC1G04GW
OCR Text ...r than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direc...
Description Inverter

File Size 79.87K  /  12 Page

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    24005

Aries Electronics, Inc.
Part No. 24005
OCR Text ...d bumped die devices interposer footprint lets the pcb designer locate impedance matching network components within 1mm of device pads. contact set interposer top side bottom side column array cross section tips pierce dut ...
Description Long-Life Hi-Frequency Sockets for BGA, LGA, QFN, MLCC, μBGA and Bumped Die Devices

File Size 1,104.07K  /  2 Page

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