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TriQuint Semiconductor,Inc.
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| Part No. |
TQHBT3
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| OCR Text |
...and thermal stability ? base etch stop for uniformity ? mocvd epitaxy ? high density interconnects; ? 2 global, 1 local ? over 6 m total thickness ? dielectric encapsulated metals ? thick metal interconnects: ? enhan... |
| Description |
InGaP HBT Foundry Service
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| File Size |
115.21K /
6 Page |
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it Online |
Download Datasheet
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TriQuint Semiconductor,Inc.
TriQuint Semiconductor, Inc.
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| Part No. |
TQHBT
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| OCR Text |
...y and thermal stability ? base etch stop for uniformity ? mocvd epitaxy ? high linearity in pa applications ? high density interconnects; ? 2 global, 1 local ? over 6 m total thickness ? dielectric encapsulated metals ? thick ... |
| Description |
nullPrecision, 100UA Gain Selectable Amplifier nullPrecision00uA的可选增益放大器
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| File Size |
255.85K /
5 Page |
View
it Online |
Download Datasheet |
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ASTEC Semiconductor
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| Part No. |
AS17XX AS1700-PWR AS1700-NPN
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| OCR Text |
...nd held awaiting only the metal etch and passivation steps, ex- tremely fast turn-around times can be achieved. the as17xx bipolar array uses a standard 20 volt bipolar technology. although quite similar to industry standard ar- rays, it ha... |
| Description |
Semicustom Bipolar Array
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| File Size |
302.58K /
20 Page |
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it Online |
Download Datasheet |
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Price and Availability
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