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For die cell Found Datasheets File :: 3603    Search Time::3.094ms    
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    MMDF2P01HD ON2166 MMDF2P01HDR2

MOTOROLA INC
Motorola, Inc
Part No. MMDF2P01HD ON2166 MMDF2P01HDR2
OCR Text ...6" thick single sided) with one die operating, 10 sec. max. ORDERING INFORMATION Device MMDF2P01HDR2 Reel Size 13 Tape Width 12 mm embos...cell density low voltage MOSFETs, high cell density MOSFET diodes are faster (shorter trr), have les...
Description 2 A, 12 V, 0.2 ohm, 2 CHANNEL, P-CHANNEL, Si, POWER, MOSFET
DUAL TMOS POWER FET 2.0 AMPERES 12 VOLTS
From old datasheet system

File Size 283.97K  /  10 Page

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    MMDF2P02E ON2168

Motorola Mobility Holdings, Inc.
Motorola, Inc
Part No. MMDF2P02E ON2168
OCR Text ...6" thick single sided) with one die operating, 10 sec. max. ORDERING INFORMATION Device MMDF2P02ER2 Reel Size 13 Tape Width 12 mm emboss...cell Density trr High cell Density trr tb ta t, TIME Figure 11. Reverse Recovery Time (trr) ...
Description DUAL TMOS MOSFET 2.5 AMPERES 25 VOLTS 2 A, 20 V, 0.4 ohm, 2 CHANNEL, P-CHANNEL, Si, POWER, MOSFET
From old datasheet system

File Size 273.69K  /  10 Page

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    MMDF2P02HD ON2170

MOTOROLA[Motorola, Inc]
Part No. MMDF2P02HD ON2170
OCR Text ...6" thick single sided) with one die operating, 10 sec. max. ORDERING INFORMATION Device MMDF2P02HDR2 Reel Size 13 Tape Width 12 mm embos...cell density low voltage MOSFETs, high cell density MOSFET diodes are faster (shorter trr), have les...
Description From old datasheet system
DUAL TMOS POWER FET 2.0 AMPERES 20 VOLTS

File Size 256.92K  /  10 Page

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    MMFT3055VL MMFT3055VL_D ON2227 MMFT3055VLT3

MOTOROLA INC
Motorola, Inc.
ON Semi
Part No. MMFT3055VL MMFT3055VL_D ON2227 MMFT3055VLT3
OCR Text ... 0.25 from package to center of die) Internal Source Inductance (Measured from the source lead 0.25 from package to source bond pad) (1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%. (2) Switching characteristics are independent of operat...
Description 1500 mA, 60 V, N-CHANNEL, Si, SMALL SIGNAL, MOSFET, TO-261AA
TMOS POWER FET 1.5 AMPERES 60 VOLT
N-hannel Enhancement-ode Silicon Gate
From old datasheet system

File Size 223.69K  /  10 Page

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    MMFT3055V

Motorola, Inc
Part No. MMFT3055V
OCR Text ... 0.25 from package to center of die) Internal Source Inductance (Measured from the source lead 0.25 from package to source bond pad) (1) Pulse Test: Pulse Width 300 s, Duty Cycle 2%. (2) Switching characteristics are independent of operat...
Description TMOS POWER FET 1.7 AMPERES 60 VOLTS

File Size 91.15K  /  4 Page

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    MTD2955V

MOTOROLA[Motorola, Inc]
Part No. MTD2955V
OCR Text ...ntact screw on tab to center of die) (Measured from the drain lead 0.25 from package to center of die) Internal Source Inductance (Measured from the source lead 0.25 from package to source bond pad) (1) Pulse Test: Pulse Width 300 s, Duty ...
Description TMOS POWER FET 12 AMPERES 60 VOLTS RDS(on) = 0.230 OHM

File Size 145.17K  /  10 Page

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    K9F6408U0A-TCB0 K9F6408U0A-TIB0

SAMSUNG[Samsung semiconductor]
Samsung Electronics Inc
Part No. K9F6408U0A-TCB0 K9F6408U0A-TIB0
OCR Text ...ogram in the same page Before(M-die) 1,000us(Max.) 10 Cycles After(A-die) 500us(Max.) Main Array: 2 Cycles Spare Array: 3 Cycles Draft Da...cell to Register (tR) Before(M-die) 7us(Max.) After(A-die) 10us(Max.) Jan. 10th 2000 Final ...
Description From old datasheet system
EEPROM,NAND FLASH,8MX8,CMOS,TSOP,44PIN,PLASTIC
8M x 8 Bit NAND Flash Memory

File Size 344.78K  /  26 Page

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    MAX2601 MAX2601ESA MAX2601-MAX2602 MAX2602ESA MAX2602 MAX2602E_D MAX2602E/D

MAXIM - Dallas Semiconductor
Maxim Integrated Products, Inc.
Maixm
MAXIM[Maxim Integrated Products]
Part No. MAX2601 MAX2601ESA MAX2601-MAX2602 MAX2602ESA MAX2602 MAX2602E_D MAX2602E/D
OCR Text ...he MAX2602 is also available in die form. MAX2601/MAX2602 ______________Ordering Information PART MAX2601ESA MAX2602ESA MAX2602E/D TEMP. RANGE -40C to +85C -40C to +85C -40C to +85C PIN-PACKAGE 8 PSOPII 8 PSOPII Dice* *Dice are sp...
Description 3.6V的,1W的射频功率晶体管00MHz的应
3.6V / 1W RF Power Transistors for 900MHz Applications
3.6V, 1W RF Power Transistors for 900MHz Applications

File Size 47.40K  /  6 Page

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    MGSF3442VT1 MGSF3442VT1_D ON1902 ON1901

ON Semi
MOTOROLA[Motorola, Inc]
Part No. MGSF3442VT1 MGSF3442VT1_D ON1902 ON1901
OCR Text ...ted junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA . Using the values provided on the data sheet for the TSOP-6 package, PD can be calculated as follows: P...
Description N-CHANNEL ENHANCEMENT-MODE TMOS MOSFET
From old datasheet system

File Size 138.26K  /  6 Page

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    MGSF3442XT1 MGSF3442XT1_D ON1904 ON1903

ON Semi
MOTOROLA[Motorola, Inc]
Part No. MGSF3442XT1 MGSF3442XT1_D ON1904 ON1903
OCR Text ...ted junction temperature of the die, RJA, the thermal resistance from the device junction to ambient, and the operating temperature, TA . Using the values provided on the data sheet for the TSOP-6 package, PD can be calculated as follows: P...
Description N-CHANNEL ENHANCEMENT-MODE TMOS MOSFET
From old datasheet system

File Size 82.92K  /  4 Page

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For die cell Found Datasheets File :: 3603    Search Time::3.094ms    
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