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bonded-pair Datasheet PDF File

For bonded-pair Found Datasheets File :: 314 Search Time::2.016ms
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				Hittite Microwave Corporation
Part No.	HMC29208
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs MMIC DOUBLE-BALANCED MIXER, 18 - 32 GHz
File Size	199.72K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC32907
OCR Text	...ith the chip mounted and ribbon bonded into in a 50-ohm microstrip test fixture that contains 5-mil alumina substrates between the chip and ...pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched wit...
Description	GaAs MMIC DOUBLE-BALANCED MIXER, 25 - 40 GHz
File Size	202.44K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC33108
OCR Text	...bonds should be thermosonically bonded with a force of 40 - 60 grams. DC bonds of 0.001" (0.025mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40 - 50 grams and wedge bonds at 18 - 22 grams. ...
Description	GaAs MMIC PASSIVE FREQUENCY DOUBLER, 12 - 18 GHz INPUT
File Size	165.70K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corpo... Hittite Microwave Corporation
Part No.	HMC36107 HMC361
OCR Text	...wer output, this port should be bonded to ground. For low power output, this port should be floating. 1-6 For price, delivery, and to ...pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched wit...
Description	GaAs HBT MMIC DIVIDE-BY-2, DC - 11 GHz
File Size	201.38K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC36207 HMC362
OCR Text	...wer output, this port should be bonded to ground. For low power output, this port should be floating. 1 - 12 For price, delivery, and ...pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched wit...
Description	GaAs HBT MMIC DIVIDE-BY-4, DC - 11 GHz
File Size	202.66K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC36307 HMC363
OCR Text	...wer output, this port should be bonded to ground. For low power output, this port should be floating. 1 - 18 For price, delivery, and ...pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched wit...
Description	GaAs HBT MMIC DIVIDE-BY-8, DC - 12 GHz
File Size	208.91K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC36407
OCR Text	...wer output, this port should be bonded to ground. For low power output, this port should be floating. 1 - 24 For price, delivery, and ...pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched wit...
Description	GaAs HBT MMIC DIVIDE-BY-2, DC - 13 GHz
File Size	206.42K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC36507
OCR Text	...wer output, this port should be bonded to ground. For low power output, this port should be floating. 1 - 30 For price, delivery, and ...pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched wit...
Description	GaAs HBT MMIC DIVIDE-BY-4, DC - 13 GHz
File Size	205.27K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH509
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs HEMT LOW NOISE AMPLIFIER, 71 - 86 GHz
File Size	188.52K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-ALH313
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs HEMT MMIC LOW NOISE AMPLIFIER, 27 - 33 GHz
File Size	184.44K / 6 Page	View it Online	Download Datasheet

For bonded-pair Found Datasheets File :: 314 Search Time::2.016ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |