A8MD-1163 pdf Datasheet P12 Part Num --- IC-ON-LINE


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A8MD-1163 Datasheet PDF File

For A8MD-1163 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |


Part No.	CAT1163P-30 CAT1163J-30TE13
Description	SPECIALTY MICROPROCESSOR CIRCUIT, PDIP8 SPECIALTY MICROPROCESSOR CIRCUIT, PDSO8
File Size	434.26K / 14 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-116322000LF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 32 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

HUA FENG CIRCUIT

					Molex Electronics Ltd.
Part No.	5566-16A 39-28-1163 0039281163
Description	4.20mm (.165") Pitch Mini-Fit Jr.??/a> 4.20mm (.165) Pitch Mini-Fit Jr.
File Size	500.20K / 6 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10145891-1631J13LF
Description	DDR4 DIMM, Storage and Server Connector, Vertical, Surface Mount, 288 Position, 0.85mm (0.033in) Pitch
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K4S511633F-YPC K4S511633F K4S511633F-F1H K4S511633F-F1L K4S511633F-F75 K4S511633F-L K4S511633F-YC
Description	8M x 16Bit x 4 Banks Mobile SDRAM 8米16 × 4银行移动SDRAM
File Size	111.06K / 12 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	GSB4116344HR
Description	USB 3.2 GEN2, Type A, Upright Reverse, 9 Pins, Shell Kink with Nickel Plating, 30u\\ Gold, Dip 3.1mm, Blue High Temperature Housing, Tray Packaging
Tech specs				Official Product Page

					Samsung Electronics
Part No.	K4X51163PG-FGC6 K4X51163PG-FGC8
Description	32Mx16 Mobile DDR SDRAM
File Size	364.01K / 23 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	RJE714881163
Description	Modular Jacks, Input Output Connectors, 8P8C, With Shield, With LEDs.
Tech specs				Official Product Page

					Samsung Semiconductor
Part No.	K4H511638B-TC/LB3
Description	DDR Sdram 512Mb B-die
File Size	259.87K / 23 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10106116-3006001LF
Description	PwrBlade+® , Power Connectors, 3ACP+24S STB, Right Angle, Header.
Tech specs				Official Product Page


Part No.	K4T51163QE-ZPD50
Description	32M X 16 DDR DRAM, 0.5 ns, PBGA84
File Size	449.51K / 25 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54112-116342000LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page


Part No.	K4T51163QI-HIE70
Description	32M X 16 DDR DRAM, 0.4 ns, PBGA84
File Size	801.23K / 42 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-116302000RLF
Description	BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 30 position, 2.54mm (0.100in) pitch
Tech specs				Official Product Page

					Cree, Inc
Part No.	CP12817-LXP3-RS2 CP11632-LXP3-D CP11633-LXP3-M CP11634-LXP3-O-90
Description	Leila series
File Size	508.24K / 7 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	GSB3116346FHR
Description	USB 3.2, Type A, Receptacle, Upright Reverse, 9 Pins, Shell Kink with Nickel Plating, 30u\\ Gold, Dip 4.4mm, Blue High Temperature Housing, Tray Packaging
Tech specs				Official Product Page

					Samsung Electronic SAMSUNG[Samsung semiconductor] SAMSUNG SEMICONDUCTOR CO. LTD.
Part No.	K4S511632M K4S511632M-TC K4S511632M-TL1H K4S511632M-TL1L K4S511632M-TL75
Description	512Mbit SDRAM
File Size	110.24K / 11 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	RJE7B1881163
Description	Modular Jack - High Performance, Input Output Connectors 8P8C, CAT 6A, RA, Shield, with LEDs.
Tech specs				Official Product Page

					Samsung Semiconductor Co., Ltd. SAMSUNG SEMICONDUCTOR CO. LTD. SAMSUNG[Samsung semiconductor] Samsung Electronic
Part No.	K4S51163PF-YF K4S51163PF-F1L K4S51163PF-F90 K4S51163PF-Y K4S51163PF-YF750
Description	32M X 16 SYNCHRONOUS DRAM, 6 ns, PBGA54 FBGA-54 8M x 16Bit x 4 Banks Mobile-SDRAM 8米16 × 4银行移动SDRAM
File Size	110.82K / 12 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	GSB4116343HR
Description	USB 3.2 GEN2, Type A, Upright Reverse, 9 Pins, Shell Kink with Nickel Plating, 30u\\ Gold, Dip 2.8mm, Blue High Temperature Housing, Tray Packaging
Tech specs				Official Product Page

For A8MD-1163 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |

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