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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
TLP2304
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| Description |
Photocoupler (photo-IC output), High-speed / IPM driver, 1 Mbps, 3750 Vrms, 5pin SO6
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78290-136HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68690-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
69190-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
89852-304LF
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| Description |
Dubox®, Board to Board connector, 2.54mm (0.100in), Receptacle, Right Angle, Through Hole, Selective Loading, Double Row, 9 positions
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
75168-323-04LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 04 Positions, 2.54mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
65823-049
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| Description |
Quickie Header, Wire to Board Connector, Double Row, 10 Positions, 2.54 mm (0.1 in.), Right Angle Header 0.76 um (30 u\\.) Gold Mating Plating.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
76342-304HLF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Top Entry, Double Row , 8 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901362202 90136-2202
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| Description |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
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| File Size |
254.60K /
5 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
65823-049LF
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| Description |
Quickie Header, Wire to Board Connector, Double Row, 10 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header 30u\\/0.76um Au/GXT Plating.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901361318 90136-1318
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| Description |
2.54mm (.100) Pitch C-Grid III?Header, Single Row, Vertical, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
159.40K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
65823-047LF
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| Description |
Quickie Header, Wire to Board Connector, Double Row, 50 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header 30u\\/0.76um Au/GXT Plating.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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