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  90130-1136 Datasheet PDF File

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    0039013083 0039013083-18

Molex Electronics Ltd.
Part No. 0039013083 0039013083-18
Description Mini-Fit Jr. Plug Housing, Dual Row, 8 Circuits, UL 94V-2, without Panel Mounting Ears

File Size 37.87K  /  2 Page

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Texas Instruments

Part No. TMUX1136DGSR
Description 5-V low-leakage-current, 2:1, 2-channel precision analog switch 10-VSSOP -40 to 125
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901303112

Molex Electronics Ltd.
Part No. 0901303112
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 12 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.44K  /  4 Page

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Texas Instruments

Part No. TMUX1136DQAR
Description 5-V low-leakage-current, 2:1, 2-channel precision analog switch 10-USON -40 to 125
Tech specs    

Official Product Page

    0901303114

Molex Electronics Ltd.
Part No. 0901303114
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 14 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.44K  /  4 Page

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Coilcraft Inc

Part No. RFS1113-682ME
Description General Purpose Inductor,
Tech specs    

Official Product Page

    0901303118

Molex Electronics Ltd.
Part No. 0901303118
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 18 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0901303116

Molex Electronics Ltd.
Part No. 0901303116
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 16 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.44K  /  4 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    0901303344

Molex Electronics Ltd.
Part No. 0901303344
Description
File Size 586.05K  /  7 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0901303330 90130-3330

Molex Electronics Ltd.
Part No. 0901303330 90130-3330
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 30 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    90130-1140 0901301140

Molex Electronics Ltd.
Part No. 90130-1140 0901301140
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 40 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    0901303340

Molex Electronics Ltd.
Part No. 0901303340
Description
File Size 168.46K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90130-1218 0901301218

Molex Electronics Ltd.
Part No. 90130-1218 0901301218
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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