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STATSCHIP[STATS ChipPAC, Ltd.]
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Part No. |
LFBGA-H FBGA
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OCR Text |
...ximum accuracy. Die Size (mm) 4.5 x 4.5 10.2 x 10.2 Thermal Performance ja(C/W) 34.1 19.4
Note: Simulation data for package mounted on 4 ...40mm max. typical) TFBGA: 1.20mm max. VFBGA: 1.00mm max. WFBGA: 0.80mm max. UFBGA: 0.55mm max.
LF... |
Description |
Fine Pitch Ball Grid Array
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File Size |
555.50K /
2 Page |
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Actel Corporation
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Part No. |
BPW729-1230-27AB95L BPW729-1570-27AB95 CCW729-1570-27AB95
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OCR Text |
...h ) 29 = raised smt.. ( ?a? = 5,00mm if 1,27mm pitch; 3,20mm if 1,00mm pitc h; 2,80mm if 0,80mm pitch, 2.30mm if <0.80mm pitch ) 28 = special raised smt - only for 1.00 & 0.80mm pitch?..... ( ?a? = 4,50mm ) 70 = standard solder tai... |
Description |
SE-BGG729, E-Tec lead free prototype socket drawing for BGG729 and BGG729 packages BGA729, IC SOCKET
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File Size |
1,371.87K /
8 Page |
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it Online |
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Samtec, Inc
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Part No. |
CRIMP-SPECIFICATIONS
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OCR Text |
...e "c-179-02-crimp-26-dwc" table 5 cut cable depth/dimension bwc-01-04-01 0.55[14mm] bwc-01-16-01 1.34[34mm] bwc-02-10-01 0.71[18mm] bwc-02...40mm] stcp-08-01 0.91[23mm] sctp-12-01 1.06[27mm] sctp-16-01 1.18[30mm] sctp-24-01 1.42[36mm] lspc-... |
Description |
CRIMP/STRIP SPECIFICATIONS
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File Size |
479.71K /
4 Page |
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it Online |
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Price and Availability
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