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Amphenol Communications Solutions |
| Part No. |
10132445-18LF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Receptacle Housing, 18 Positions, Black Color, Nylon 66, GW Compatible.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0585 0015800585
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
1,218.25K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
89891-324LF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 48 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10106132-4009101LF
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| Description |
PwrBlade+® , Power Connectors, 4HDP+36S STB, Right Angle, Header.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
10132449-1621GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Min Matte Tin plating, Black Color, 16 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0285 0015800285
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
1,218.29K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10132449-0411GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Black Color, 4 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0283 0015800283
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
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| File Size |
1,218.29K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10132450-0611GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Black Color, 6 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0063 0015800063
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plati Molex Electronics Ltd.
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| File Size |
1,218.42K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10132449-0421GLF
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| Description |
Minitek® Pwr 3.0 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Min Matte Tin plating, Black Color, 4 Positions, GW Compatible PA9T, Tray packing.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0083 0015800083
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plati Molex Electronics Ltd.
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| File Size |
1,218.46K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
71991-324HLF
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry, 48 Position, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0583 0015800583
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
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| File Size |
1,218.29K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
91601-324LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical , Surface Mount, Dual Entry ,Single row , 24 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0581 0015800581
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, Tin (Sn) Plating
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| File Size |
1,218.24K /
7 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10132446-18LF
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| Description |
Minitek® Pwr 3.0 HCC, Plug Housing, 18 Positions, Black Color, GW Compatible.
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| Tech specs |
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Official Product Page
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