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wire-bond Datasheet PDF File

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				NICHIA CORPORATION List of Unclassifed Manufacturers ETC[ETC] Electronic Theatre Controls, Inc.
Part No.	NSPB320 NSPB320BS
OCR Text	...nfirmed that no damage, such as wire bond failure or resin deterioration, will occur. Nichia's LEDs should not be soldered directly to double sided PC boards because the heat will deteriorate the epoxy resin. * When it is necessary to clamp...
Description	SPECIFICATIONS FOR NICHIA BLUE LED 蓝规格的日亚化学发光二极
File Size	362.42K / 15 Page	View it Online	Download Datasheet

				Analog Devices
Part No.	ADF4106
OCR Text	...mable Antibacklash Pulsewidth 3-Wire Serial Interface Analog and Digital Lock Detect Hardware and Software Power-Down Modes APPLICATIONS Bro...bond wire should not be used with the ADF4106 die. CAUTION ESD (electrostatic discharge) sensitiv...
Description	PLL Frequency Synthesizer
File Size	265.21K / 20 Page	View it Online	Download Datasheet

				Atmel Corp. ATMEL[ATMEL Corporation]
Part No.	AT16244F AT16244F-25XC AT16244F-25YC AT16244G AT16244G-20XC AT16244G-20YC
OCR Text	...the parasitic inductance of the wire bond and package pins. This occurrence is called simultaneous switching noise. Atmel's AT16244 products have minimized this phenomenon as shown on the graph. Output data is for 15 outputs switching simul...
Description	AT16244 Fast Logic 16-Bit Buffer/Line Driver
File Size	51.96K / 6 Page	View it Online	Download Datasheet

				ATMEL[ATMEL Corporation] Atmel Corp. Atmel, Corp.
Part No.	AT16245F AT16245F-25XC AT16245F-25YC AT16245G AT16245G-20XC AT16245G-20YC AT16245F-20XC AT16245F-20YC
OCR Text	...the parasitic inductance of the wire bond and package pins. This occurrence is called simultaneous switching noise. Atmel's AT16245 products have minimized this phenomenon as shown on the graph. Output data is for 15 outputs switching simul...
Description	Fast logic bi-directional transceiver, 6.0V AT16245 Fast Logic Bi-Directional Transceiver DUAL 8-BIT TRANSCEIVER, TRUE OUTPUT, PDSO48
File Size	65.32K / 6 Page	View it Online	Download Datasheet

				Atmel, Corp. Atmel Corp. ATMEL[ATMEL Corporation]
Part No.	AT16373F AT16373F-25XC AT16373F-25YC AT16373G AT16373G-20XC AT16373G-20YC AT16373F-20XC AT16373F-20YC
OCR Text	...the parasitic inductance of the wire bond and package pins. This occurrence is called simultaneous switching noise. Atmel's AT16373 products have minimized this phenomenon as shown on the graph. Output data is for 15 outputs switching simul...
Description	AT16373 Fast Logic 16-Bit Transparent Latch DUAL 8-BIT DRIVER, TRUE OUTPUT, PDSO48 Fast logic 16-bit transparent latch, 6.0V
File Size	54.24K / 6 Page	View it Online	Download Datasheet

				ATMEL[ATMEL Corporation] Atmel Corp. Atmel, Corp.
Part No.	AT16646F AT16646F-25XC AT16646F-25YC AT16646G AT16646G-20XC AT16646G-20YC
OCR Text	...the parasitic inductance of the wire bond and package pins. This occurrence is called simultaneous switching noise. Atmel's AT16646 products have minimized this phenomenon as shown on the graph. Output data is for 15 outputs switching simul...
Description	AT16646 Fast Logic 16-Bit Tri-State Register AT16646 Fast Logic 16-Bit Tri-State Register DUAL 8-BIT REGISTERED TRANSCEIVER, TRUE OUTPUT, PDSO56
File Size	64.16K / 6 Page	View it Online	Download Datasheet

				美国讯泰微波有限公司上海代表 HITTITE[Hittite Microwave Corporation]
Part No.	HMC364
OCR Text	...the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 C and a ball bonding force of 40 to 50 grams or wedge bonding fo...
Description	GaAs HBT MMIC DIVIDE-BY-2, DC - 13.0 GHz
File Size	185.26K / 6 Page	View it Online	Download Datasheet

				TRIQUINT SEMICONDUCTOR INC TRIQUINT[TriQuint Semiconductor] http://
Part No.	TGS8250 TGS8250-SCC
OCR Text	...ermocompression and thermosonic wire bonding processes. The TGS8250-SCC is supplied in chip form and is engineered for high-volume automated...bond wires as specified in the "Recommended Assembly Diagram". The S-parameters are also available o...
Description	SPDT FET Switch
File Size	540.14K / 7 Page	View it Online	Download Datasheet

				Motorola, Inc. MOTOROLA[Motorola, Inc]
Part No.	MPX53D MPX53DP MPXV53GC7U MPX53 MPX53GP MPXV53GC MPXV53GC6T1 MPXV53GC6U
OCR Text	...Differential SILICONE DIE COAT WIRE BOND Figure 3. Linearity Specification Comparison DIE LEAD FRAME Figure 4. Cross-Sectional Diagram (not to scale) Figure 4 illustrates the differential or gauge configuration in the unibody c...
Description	50 KPA UNCOMPENSATED SILICON PRESSURE SENSORS From old datasheet system
File Size	144.58K / 8 Page	View it Online	Download Datasheet

				Motorola
Part No.	MPXA6115A MPXH6115A
OCR Text	...FLUORO SILICONE GEL DIE COAT P1 WIRE BOND LEAD FRAME THERMOPLASTIC CASE 100 nF VS Pin 2 MPXA6115A MPXH6115A Vout Pin 4 GND Pin 3 ABSOLUTE ELEMENT SEALED VACUUM REFERENCE DIE BOND 47 pF 51 K DIE STAINLESS STEEL CAP +5.0 V to ADC Fig...
Description	MPXA6115A High Temperature Accuracy Integrated Silicon Pressure Sensor for Manifold Absolute Pressure, Altimeter or Barometer Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure
File Size	145.11K / 9 Page	View it Online	Download Datasheet

For wire-bond Found Datasheets File :: 3390 Search Time::2.859ms
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