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  stencil Datasheet PDF File

For stencil Found Datasheets File :: 1989    Search Time::2.625ms    
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    BSP19AT1 ON0220

MOTOROLA
ONSEMI[ON Semiconductor]
Part No. BSP19AT1 ON0220
OCR Text ...print. 3 BSP19AT1 SOLDER stencil GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste ...
Description From old datasheet system
NPN SILICON HIGH VOLTAGE TRANSISTOR SURFACE MOUNT

File Size 81.72K  /  6 Page

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    IRDC3477

International Rectifier
Part No. IRDC3477
OCR Text ... from: http:/// irdc3477 14 stencil design the stencil apertures for the lead lands should be approxim ately 80% of the area of the lead lads. reducing the amount of solder deposited will minimize the occurrences of lead shorts. if t...
Description User Guide for the IR3477M Evaluation Board

File Size 1,148.16K  /  15 Page

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    IRDC3476

International Rectifier
Part No. IRDC3476
OCR Text ...d from: http:/// irdc3476 14 stencil design the stencil apertures for the lead lands should be approxim ately 80% of the area of the lead lads. reducing the amount of solder deposited will minimize the occurrences of lead shorts. if t...
Description User Guide for the IR3476M Evaluation Board

File Size 991.98K  /  15 Page

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    Lite-On Technology, Corp.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
Part No. HSDL-9000 HSDL9000
OCR Text ... 1.0 Solder Pad, Mask and Metal stencil Aperture METAL stencil FOR SOLDER PASTE PRINTING stencil APERTURE LAND PATTERN SOLDER MASK PCBA Figure 7. stencil and PCBA. 1.1 Recommended Land Pattern 4.7 1.5 0.6 1.27 3....
Description Miniature Surface-Mount Ambient Light Photo Sensor 微型表面贴装环境亮度传感

File Size 267.19K  /  14 Page

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    IRDC3473

International Rectifier
Part No. IRDC3473
OCR Text ...ded from: http:/// irdc3473 stencil design the stencil apertures for the lead lands should be approxi mately 80% of the area of the lead lads. reducing the amount of solder deposited will minimize the occurrences of lead shorts. if t...
Description User Guide for the IR3473M Evaluation Board

File Size 959.66K  /  15 Page

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    CALMIRCO[California Micro Devices Corp]
Part No. CM1400-03 CM1400-03CS CM1400-03CP
OCR Text ...tion Solder Mask Opening Solder stencil Thickness Solder stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum ...
Description 6 Channel EMI Filter Array with ESD Protection

File Size 584.61K  /  10 Page

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    SP0103BE3

List of Unclassifed Manufacturers
ETC[ETC]
Electronic Theatre Controls, Inc.
Part No. SP0103BE3
OCR Text ...P0103BE3 8. RECOMMENDED SOLDER stencil PATTERN Notes: * * * The design requires that an acoustic seal be established between the SiSonic and customer PCB. This is accomplished via a solder seal. Solder stencil Thickness = 0.127 min to 0...
Description From old datasheet system
Zero Height Amplified SiSonic Microphone Specification

File Size 417.02K  /  11 Page

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    MOTOROLA[Motorola, Inc]
ON Semi
MOTOROLA[Motorola Inc]
Part No. PZTA14T1 PZTA14T1_D ON2782
OCR Text ...Device Data PZTA14T1 SOLDER stencil GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste ...
Description From old datasheet system
SOT-223 PACKAGE MEDIUM POWER NPN SILICON DARLINGTON TRANSISTOR SURFACE MOUNT

File Size 167.85K  /  6 Page

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    CM1420-03CP

ON Semiconductor
Part No. CM1420-03CP
OCR Text ...k opening 0.290 mm round solder stencil thickness 0.125 ? 0.150 mm solder stencil aperture opening (laser cut, 5% tapered walls) 0.300 mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek ...
Description    LCD EMI Filter Array with ESD Protection

File Size 1,205.00K  /  12 Page

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    2SC4617 2SC4617-D

ONSEMI[ON Semiconductor]
Part No. 2SC4617 2SC4617-D
OCR Text ... (3x) 0.5 2SC4617 SOLDER stencil GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste o...
Description NPN Silicon General Purpose Amplifier Transistor
General Purpose Amplifier Transistors(NPN Silicon)

File Size 60.35K  /  8 Page

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For stencil Found Datasheets File :: 1989    Search Time::2.625ms    
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