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Lite-On Technology, Corp. HP[Agilent(Hewlett-Packard)] Agilent (Hewlett-Packard)
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Part No. |
HSDL-9000 HSDL9000
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OCR Text |
... 1.0 Solder Pad, Mask and Metal stencil Aperture
METAL stencil FOR SOLDER PASTE PRINTING
stencil APERTURE
LAND PATTERN
SOLDER MASK
PCBA
Figure 7. stencil and PCBA.
1.1 Recommended Land Pattern
4.7 1.5
0.6
1.27 3.... |
Description |
Miniature Surface-Mount Ambient Light Photo Sensor 微型表面贴装环境亮度传感
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File Size |
267.19K /
14 Page |
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it Online |
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CALMIRCO[California Micro Devices Corp]
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Part No. |
CM1400-03 CM1400-03CS CM1400-03CP
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OCR Text |
...tion Solder Mask Opening Solder stencil Thickness Solder stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum ... |
Description |
6 Channel EMI Filter Array with ESD Protection
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File Size |
584.61K /
10 Page |
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it Online |
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MOTOROLA[Motorola, Inc] ON Semi MOTOROLA[Motorola Inc]
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Part No. |
PZTA14T1 PZTA14T1_D ON2782
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OCR Text |
...Device Data
PZTA14T1
SOLDER stencil GUIDELINES
Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste ... |
Description |
From old datasheet system SOT-223 PACKAGE MEDIUM POWER NPN SILICON DARLINGTON TRANSISTOR SURFACE MOUNT
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File Size |
167.85K /
6 Page |
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it Online |
Download Datasheet
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Price and Availability
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