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  SC16M5600APF-1636 Datasheet PDF File

For SC16M5600APF-1636 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    ADG1636BRUZ-REEL7 ADG1636BCPZ-REEL7

Analog Devices
Part No. ADG1636BRUZ-REEL7 ADG1636BCPZ-REEL7
Description 1 OHM Typical On Resistance

File Size 386.10K  /  16 Page

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Amphenol Communications Solutions

Part No. 61082-163602LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 160 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    K7D163674B-HC30 K7D163674B-HC27 K7D163674B-HC33 K7D161874B-HC37 K7D161874B-HC27 K7D161874B-HC30 K7D161874B-HC33 K7D16367

Samsung semiconductor
http://
Part No. K7D163674B-HC30 K7D163674B-HC27 K7D163674B-HC33 K7D161874B-HC37 K7D161874B-HC27 K7D161874B-HC30 K7D161874B-HC33 K7D163674B-HC37
Description 512Kx36 & 1Mx18 SRAM

File Size 440.50K  /  16 Page

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Amphenol Communications Solutions

Part No. 75168-316-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    K7N161831B-QFCI25 K7N163631B-QFCI25

Samsung semiconductor
Part No. K7N161831B-QFCI25 K7N163631B-QFCI25
Description    512Kx36 & 1Mx18 Pipelined NtRAM

File Size 454.87K  /  24 Page

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Amphenol Communications Solutions

Part No. 61083-163622LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    K7I161882B-FC16 K7I161882B-FC20 K7I161882B-FC25 K7I161882B-FC30 K7I163682B-FC30 K7I163682B K7I163682B-FC16 K7I163682B-FC

Samsung Semiconductor Co., Ltd.
SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K7I161882B-FC16 K7I161882B-FC20 K7I161882B-FC25 K7I161882B-FC30 K7I163682B-FC30 K7I163682B K7I163682B-FC16 K7I163682B-FC20 K7I163682B-FC25
Description 512Kx36-bit, 1Mx18-bit DDRII CIO b2 SRAM 512Kx36位,1Mx18位首席信息官b2DDRII的SRAM
GT 35C 35#16 PIN PLUG RTANG

File Size 375.70K  /  17 Page

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Amphenol Communications Solutions

Part No. 61082-163600LF
Description 0.8MM B TO B REC ASSY
Tech specs    

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K7P163666A-HC25 K7P163666A-HC33 K7P161866A-HC25 K7P163666A-HC30 K7P161866A-HC30 K7P161866A-HC33 K7P163666A-HC330 K7P161866A-HC300
Description 1M X 18 STANDARD SRAM, 1.6 ns, PBGA119
512Kx36 AND 1Mx18 Synchronous Pipelined SRAM 512Kx361Mx18同步流水线的SRAM
512K X 36 STANDARD SRAM, 1.5 ns, PBGA119

File Size 323.32K  /  14 Page

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Amphenol Communications Solutions

Part No. 61083-163602LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    K7Q163664B10 K7Q161864B

Samsung semiconductor
Part No. K7Q163664B10 K7Q161864B
Description 512Kx36 & 1Mx18 QDRTM b4 SRAM

File Size 455.40K  /  17 Page

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Amphenol Communications Solutions

Part No. 61083-163600LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 160 Positions.
Tech specs    

Official Product Page

    K7R163684B06 K7R161884B

Samsung semiconductor
Part No. K7R163684B06 K7R161884B
Description 512Kx36 & 1Mx18 QDRTM II b4 SRAM

File Size 452.10K  /  19 Page

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Amphenol Communications Solutions

Part No. 75168-116-36LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled header, Through Hole, Single Row, 36 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    K7I163682B06 K7I161882B

Samsung semiconductor
Part No. K7I163682B06 K7I161882B
Description 512Kx36 & 1Mx18 DDRII CIO b2 SRAM

File Size 411.65K  /  18 Page

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Amphenol Communications Solutions

Part No. RJMG163618101NR
Description RJMG, Input output Connectors, 1x1,10/100 with LEDs
Tech specs    

Official Product Page

    K7N163631B06 K7N161831B

Samsung semiconductor
Part No. K7N163631B06 K7N161831B
Description 512Kx36 & 1Mx18 Pipelined NtRAM
   512Kx36 & 1Mx18 Pipelined NtRAM

File Size 561.61K  /  25 Page

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Amphenol Communications Solutions

Part No. 61082-163622LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 160 Positions.
Tech specs    

Official Product Page

    K7A161830B-QI16 K7A163630B-QC16 K7A161830B-PI25 K7A161830B-QC16 K7A163630B-QC25 K7A161830B-QC25 K7A163630B-QI16 K7A16363

Samsung semiconductor
Part No. K7A161830B-QI16 K7A163630B-QC16 K7A161830B-PI25 K7A161830B-QC16 K7A163630B-QC25 K7A161830B-QC25 K7A163630B-QI16 K7A163630B-QI25 K7A163630B-PI16 K7A161830B-QI25 K7A161830B-PI16 K7A163630B-PI25 K7A163630B-PC16 K7A163630B-PC25 K7A161830B-PC16 K7A161830B-PC25
Description 512Kx36 & 1Mx18 Synchronous SRAM

File Size 414.97K  /  19 Page

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Amphenol Communications Solutions

Part No. UE86G16360033T
Description XCede I/O, High Speed Input Output Connectors, 1X1 XCede IO COMBO.
Tech specs    

Official Product Page

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