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Lite-On Technology, Corp. HP[Agilent(Hewlett-Packard)] Agilent (Hewlett-Packard)
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| Part No. |
HSDL-9000 HSDL9000
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| OCR Text |
...n this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. Note: Wet/Liquid PhotoImageable solder resist/mask is recommended.
5.1
0.2 MIN. C L SOLDER MASK
4.8
UNITS: mm
C L
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| Description |
Miniature Surface-Mount Ambient Light Photo Sensor 微型表面贴装环境亮度传感
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| File Size |
267.19K /
14 Page |
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it Online |
Download Datasheet
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Siemens Group SIEMENS AG SIEMENS[Siemens Semiconductor Group]
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| Part No. |
LAE675-U2 LAE675-T2 LAE675 LAE675-T1 LAE675-S1 Q62703-Q3764 LAE675-S2 LAE675-U1
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| OCR Text |
... dissipation Lotstoplack solder resist Cu Flache / Cu-area = 12 mm 2 per pad
1.85
7.5
Semiconductor Group
6
1998-11-05
OHLP0439
GPL06991
LA E675
Gurtung Taping
C
C
C
A
Semiconductor Group
7
19... |
| Description |
Power TOPLED Hyper-Bright LED SINGLE COLOR LED, AMBER, 2.4 mm LJT 6C 6#20 SKT WALL RECP Circular Connector; No. of Contacts:6; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:11; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:11-98 RoHS Compliant: No
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| File Size |
47.21K /
7 Page |
View
it Online |
Download Datasheet
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Price and Availability
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