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  MGA-13316-BLKG Datasheet PDF File

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Part No. MGA-66100-GP1
Description 2000 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER

File Size 99.60K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-3316-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Agilent Technologies
Part No. MGA-71543-TR1
Description Amplifier, Other - Datasheet Reference
From old datasheet system

File Size 231.61K  /  24 Page

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Amphenol Communications Solutions

Part No. 69133-168HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 68 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    AGILENT TECHNOLOGIES INC
Part No. MGA-71543-TR2
Description 100 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER

File Size 253.25K  /  24 Page

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Amphenol Communications Solutions

Part No. 69133-162HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 62 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    AGILENT TECHNOLOGIES INC
Part No. HSMP-3813-BLKG HSMP-381F-BLK
Description 100 V, SILICON, PIN DIODE

File Size 112.93K  /  9 Page

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Amphenol Communications Solutions

Part No. 131-3316-21D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    Agilent Technologies
Part No. MGA-85563-TR1 MGA-85563-BLK
Description MICROWAVE/MILLIMETER WAVE AMPLIFIER,GAAS,TSSOP,6PIN,PLASTIC
From old datasheet system

File Size 606.79K  /  13 Page

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Amphenol Communications Solutions

Part No. 69133-164HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 64 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Agilent (Hewlett-Packard)
Part No. MGA-86563-BLK MGA-86563-TR1
Description 0.5 - 6 GHz Low Noise GaAs MMIC Amplifier

File Size 79.95K  /  8 Page

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Amphenol Communications Solutions

Part No. 10118744-3133169LF
Description C - Commercial Series; Mezzanine Receptacle, SMT; 1mm Pitch; 69p
Tech specs    

Official Product Page

    MGA-87563-TR1 MGA-87563-BLK MGA-87563

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. MGA-87563-TR1 MGA-87563-BLK MGA-87563
Description 0.5 - 4 GHz 3 V Low Current GaAs MMIC LNA

File Size 82.41K  /  8 Page

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Amphenol Communications Solutions

Part No. 131-3316-11D
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    Agilent(Hewlett-Packard...
Part No. MGA-87563-BLK MGA-87563-TR1
Description 0.5 - 4 GHz 3 V Low Current GaAs MMIC LNA

File Size 83.26K  /  8 Page

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Amphenol Communications Solutions

Part No. 69133-166HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 66 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MGA-86563 MGA-86563-BLK MGA-86563-TR1

HP[Agilent(Hewlett-Packard)]
Part No. MGA-86563 MGA-86563-BLK MGA-86563-TR1
Description 0.5 - 6 GHz Low Noise GaAs MMIC Amplifier

File Size 65.61K  /  8 Page

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Amphenol Communications Solutions

Part No. 131-3316-21H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 6 Column, Left End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    Avago Technologies Ltd.
Part No. ACFM-7101-BLKG ACFM-7101-TR1G
Description PCS/Cellular/GPS Quintplexer

File Size 596.62K  /  17 Page

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Amphenol Communications Solutions

Part No. 69133-160HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 60 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For MGA-13316-BLKG Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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