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United Monolithic Semicondu...
UMS[United Monolithic Semiconductors]
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| Part No. |
CHA2066RBF_24 CHA2066RBF CHA2066RBF/24
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| OCR Text |
...for heat transfer, a proper via filling should be guaranteed during the mounting procedure to get a low thermal resistance between package and heat sink. For power devices the use of heat slugs in the motherboard instead of a via grid is re... |
| Description |
10-16GHz Self biased Low Noise Amplifier
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| File Size |
179.82K /
8 Page |
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it Online |
Download Datasheet
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United Monolithic Semicondu...
UMS[United Monolithic Semiconductors]
United Monolithic Semiconductors GmbH
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| Part No. |
CHA2069RAF_24 CHA2069RAF CHA2069RAF/24
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| OCR Text |
...for heat transfer, a proper via filling should be guaranteed during the mounting procedure to get a low thermal resistance between package and heat sink. For power devices the use of heat slugs in the motherboard instead of a via grid is re... |
| Description |
Circular Connector; No. of Contacts:100; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:23; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:23-35 RoHS Compliant: No
18-31GHz Low Noise Amplifier 18 - 31GHz之间低噪声放大器
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| File Size |
169.36K /
7 Page |
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it Online |
Download Datasheet |
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United Monolithic Semiconductors GmbH
UMS[United Monolithic Semiconductors]
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| Part No. |
CHA5093TCF_24 CHA5093TCF CHA5093TCF/24
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| OCR Text |
...for heat transfer, a proper via filling should be guaranteed during the mounting procedure to get a low thermal resistance between package and heat sink. For power devices the use of heat slugs in the motherboard instead of a via grid is re... |
| Description |
24-26GHz High Power Amplifier 24 - 26GHz高功率放大器
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| File Size |
151.10K /
6 Page |
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it Online |
Download Datasheet |
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United Monolithic Semic...
UMS[United Monolithic Semiconductors]
United Monolithic Semiconductors GmbH
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| Part No. |
CHA5390TBF_24 CHA5390TBF CHA5390TBF/24
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| OCR Text |
...for heat transfer, a proper via filling should be guaranteed during the mounting procedure to get a low thermal resistance between package and heat sink. For power devices the use of heat slugs in the motherboard instead of a via grid is re... |
| Description |
24-30GHz Medium Power Amplifier 24 - 30GHz的中等功率放大器
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| File Size |
167.02K /
6 Page |
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it Online |
Download Datasheet |
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United Monolithic Semic...
UMS[United Monolithic Semiconductors]
|
| Part No. |
CHM1290REF_24 CHM1290REF CHM1290REF/24
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| OCR Text |
...for heat transfer, a proper via filling should be guaranteed during the mounting procedure to get a low thermal resistance between package and heat sink. For power devices the use of heat slugs in the motherboard instead of a via grid is re... |
| Description |
20-30GHz SUB-HARMONICALLY PUMPED MIXER
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| File Size |
196.07K /
8 Page |
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it Online |
Download Datasheet |
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POWERINT[Power Integrations, Inc.]
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| Part No. |
DI-23
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| OCR Text |
...and improve cross-regulation by filling each winding layer across the entire width of the bobbin. * Use shield windings to improve EMI. * Use a layer of insulation tape between layers of primary winding to reduce inter-winding capacitance. ... |
| Description |
10 W, Multi-output, High Speed Modem Power Supply
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| File Size |
504.65K /
2 Page |
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it Online |
Download Datasheet |
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POWERINT[Power Integrations, Inc.]
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| Part No. |
DI-34
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| OCR Text |
... * Reduce leakage inductance by filling each winding layer across the entire width of the bobbin. * R4 should be large enough to limit dissipation, to meet <300 mW no-load target, while still limiting peak DRAIN voltage to a safe value - 20... |
| Description |
5 W Universal Adapter
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| File Size |
59.17K /
2 Page |
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it Online |
Download Datasheet |
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POWERINT[Power Integrations, Inc.]
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| Part No. |
DI-37
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| OCR Text |
...ansformer leakage inductance by filling each winding layer across the entire width of the bobbin. Choose a low-drop Schottky diode (such as Vishay SL44 - Vf = 0.42 V), to increase high line efficiency. Choose a larger DPA-Switch to increase... |
| Description |
16.5 W DC-DC Converter
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| File Size |
213.56K /
2 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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