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  85048-0567 Datasheet PDF File

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    A-70567-0358 15-80-1401 0015801401

Molex Electronics Ltd.
Part No. A-70567-0358 15-80-1401 0015801401
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Renesas Electronics Corporation

Part No. UPD78F0567K8-3B4-E1-AX
Description Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    A-70567-0341 15-80-1061 0015801061

Molex Electronics Ltd.
Part No. A-70567-0341 15-80-1061 0015801061
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Renesas Electronics Corporation

Part No. UPD78F0567FC-2N2-E1-A
Description Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
Tech specs    

Official Product Page

    A-70567-0349 15-80-1221 0015801221

Molex Electronics Ltd.
Part No. A-70567-0349 15-80-1221 0015801221
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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Renesas Electronics Corporation

Part No. UPD78F0567K8-3B4-AX
Description Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
Tech specs    

Official Product Page

    A-70567-0348 15-80-1201 0015801201

Molex Electronics Ltd.
Part No. A-70567-0348 15-80-1201 0015801201
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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Renesas Electronics Corporation

Part No. UPD78F0567FC-2N2-A
Description Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
Tech specs    

Official Product Page

    A-70567-0344 15-80-1121 0015801121

Molex Electronics Ltd.
Part No. A-70567-0344 15-80-1121 0015801121
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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Renesas Electronics Corporation

Part No. UPD78F0567MC(S)-XXX-CAA-E1-AX
Description Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion), LSSOP, /
Tech specs    

Official Product Page

    A-70567-0346 15-80-1161 0015801161

Molex Electronics Ltd.
Part No. A-70567-0346 15-80-1161 0015801161
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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Renesas Electronics Corporation

Part No. UPD78F0567MC-CAA-AX
Description Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
Tech specs    

Official Product Page

    934056733127

NXP SEMICONDUCTORS
Part No. 934056733127
Description 12 A BUF OR INV BASED PRPHL DRVR, PSIP3

File Size 36.06K  /  6 Page

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Renesas Electronics Corporation

Part No. UPD78F0567K8-3B4-E2-AX
Description Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
Tech specs    

Official Product Page

    TD62583AF TD62583AP TD62583F E005674

Toshiba, Corp.
TOSHIBA[Toshiba Semiconductor]
Part No. TD62583AF TD62583AP TD62583F E005674
Description 8CH SINGLE DRIVER 8路单驱动
From old datasheet system

File Size 205.14K  /  6 Page

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    5019400597 501940-0417 501940-0527 501940-0537 501940-0547 501940-0567 501940-0577 501940-0587 501940-0597 501940-0507

Molex Electronics Ltd.
Part No. 5019400597 501940-0417 501940-0527 501940-0537 501940-0547 501940-0567 501940-0577 501940-0587 501940-0597 501940-0507
Description 1.0 WIRE TO BOARD CONN. WAFER ASSY 1-ROW ST POSI-LOCK -LEAD FREE-

File Size 321.81K  /  5 Page

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    TD62504PA TD62503PA E005671

TOSHIBA[Toshiba Semiconductor]
Part No. TD62504PA TD62503PA E005671
Description From old datasheet system
7CH SINGLE DRIVER : COMMON EMITTER

File Size 189.62K  /  5 Page

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