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Molex Electronics Ltd.
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| Part No. |
75757-1461 0757571461
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
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| File Size |
166.43K /
4 Page |
 View
it Online |
Download Datasheet
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Texas Instruments |
| Part No. |
MSP430F46161IPZR
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| Description |
16-Bit Ultra-Low-Power MCU, 92KB Flash, 4KB RAM, Comparator, DMA, 160 Seg LCD 100-LQFP -40 to 85
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| Tech specs |
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Get Free Sample |
Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-1462 0757571462
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 4.75mm (.187) PC Tail Length
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| File Size |
166.45K /
4 Page |
View
it Online |
Download Datasheet |
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Texas Instruments |
| Part No. |
MSP430F46161IPZ
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| Description |
16-Bit Ultra-Low-Power MCU, 92KB Flash, 4KB RAM, Comparator, DMA, 160 Seg LCD 100-LQFP -40 to 85
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
ISL6161CBZA
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| Description |
Dual Power Distribution Controller
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
ISL6161CBZA-T
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| Description |
Dual Power Distribution Controller
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
ISL6161IVZA-T
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| Description |
Dual Power Distribution Controller
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-1401 0757571401
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
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| File Size |
166.40K /
4 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
ISL6161IBZA-T
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| Description |
Dual Power Distribution Controller
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
ISL6161IBZA
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| Description |
Dual Power Distribution Controller
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0341 0757570341
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
131-7616-11D
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| Description |
Paladin® 112Gb/s Backplane Connector, 7-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0332 0757570332
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
131-6616-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0331 0757570331
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77316-161LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single row , Polarized, 11 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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