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  55487-1119 Datasheet PDF File

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    1511193008

Molex Electronics Ltd.
Part No. 1511193008
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin Plating

File Size 51.53K  /  2 Page

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Rochester Electronics LLC

Part No. 74AC11191DW
Description 74AC11191 - Binary Counter
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    1511193014

Molex Electronics Ltd.
Part No. 1511193014
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-194-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 04 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1511193016

Molex Electronics Ltd.
Part No. 1511193016
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 5159002311193111LF
Description Standard Power Receptacle, Type F24/H7, Vertical, Solder-to-Wire/Faston, 31 Position, 5.08mm (0.2inch) Centerline
Tech specs    

Official Product Page

    1511193018

Molex Electronics Ltd.
Part No. 1511193018
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin Plating

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-195-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 10 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1511195016

Molex Electronics Ltd.
Part No. 1511195016
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 68461-119HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Right Angle, 10.16 mm (0.4 in.) Mating, 8.13 mm (0.32 in.) Tail
Tech specs    

Official Product Page

    JRC
Part No. NJG1119PB4
Description Dual LNA

File Size 724.95K  /  24 Page

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Amphenol Communications Solutions

Part No. 77311-195-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1511194010

Molex Electronics Ltd.
Part No. 1511194010
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-197-10LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 10 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1511195012

Molex Electronics Ltd.
Part No. 1511195012
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 78511-119HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    1511195010

Molex Electronics Ltd.
Part No. 1511195010
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 77311-119-04LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 04 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    2SB1119 2SD1619 2SB1119S

SANYO[Sanyo Semicon Device]
Sanyo Electric Co.,Ltd.
Part No. 2SB1119 2SD1619 2SB1119S
Description 5-Pin µP Supervisory Circuits with Watchdog and Manual Reset
LF Amp,Electronic Governor Applications
LF Amp/Electronic Governor Applications

File Size 85.59K  /  3 Page

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Amphenol Communications Solutions

Part No. 70218-1119LF
Description 4 Row Signal Header, Straight, Press-Fit
Tech specs    

Official Product Page

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