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FX980L7 CPC60UT1 0AA30 AS3691B STP20N SMA12A ADVANCED 125C1
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  51142-0400 Datasheet PDF File

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    A-70400-1276

Molex Electronics Ltd.
http://
Part No. A-70400-1276
Description 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Female,Single Row, Version C, Front Ribs, Wire Size 26, 0.76μm (30μ) Gold (Au), 17 Circuits

File Size 159.40K  /  3 Page

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Amphenol Cables on Demand

Part No. SF-NDYYYF0004-001.5M
Description Amphenol SF-NDYYYF0004-001.5M 1.5m (4.9') 400GbE QSFP-DD Cable - Amphenol 400-Gigabit Ethernet Passive Copper QSFP Double Density Cable (Dual Entry 30 AWG) - QSFP-DD to QSFP-DD
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    A-70400-1275

Molex Electronics Ltd.
http://
Part No. A-70400-1275
Description 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 26, 0.76μm (30μ) Gold (Au), 16 Circuits

File Size 159.40K  /  3 Page

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Amphenol Communications Solutions

Part No. 78511-421HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 21 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    A-70400-1274

Molex Electronics Ltd.
http://
Part No. A-70400-1274
Description 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 26, 0.76μm (30μ) Gold (Au), 15 Circuits

File Size 159.40K  /  3 Page

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Amphenol Communications Solutions

Part No. 78511-428HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 28 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    A-70400-1273

Molex Electronics Ltd.
http://
Part No. A-70400-1273
Description 2.54mm (.100) Pitch SL?/a> Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 26, 0.76μm (30μ) Gold (Au), 14 Circuits

File Size 159.40K  /  3 Page

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Amphenol Communications Solutions

Part No. 78511-420HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    A-70400-0510

Molex Electronics Ltd.
Part No. A-70400-0510
Description
File Size 164.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 10137785-051142LF
Description Minitek® Pwr 4.2 HCC, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 5 Positions, Non GW Compatible, without Post, Tray packing.
Tech specs    

Official Product Page

    A-70400-0511

Molex Electronics Ltd.
Part No. A-70400-0511
Description
File Size 164.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 78511-422HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 22 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    A-70400-0512

Molex Electronics Ltd.
Part No. A-70400-0512
Description
File Size 164.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 78511-429HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 29 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    A-70400-1451

Molex Electronics Ltd.
Part No. A-70400-1451
Description 2.54mm (.100) Pitch SL Insulation Displacement Connector Assembly, Female, Single Row, Version C, Front Ribs, Wire Size 28, 0.76μm (30μ) Gold (Au), 17 Circuits

File Size 157.31K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-5114-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 4 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    A-70400-3155

Molex Electronics Ltd.
Part No. A-70400-3155
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female,Single Row, Version G, Positive Lock, Wire Size 22, 3.81楼矛m (150楼矛") Tin/Lead (SnPb

File Size 162.46K  /  3 Page

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Amphenol Communications Solutions

Part No. 10136647-051142LF
Description Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, Tin plating, Natural Color, 5 Positions, Non GW Compatible, without Posts, Tray packing.
Tech specs    

Official Product Page

    A-70400-3371

Molex Electronics Ltd.
Part No. A-70400-3371
Description 2.54mm (.100") Pitch SL垄芒 Insulation Displacement Connector Assembly, Female, Single Row, Version A, Nonpolarized, Wire Size 22, 0.76楼矛m (30楼矛") Gold (Au)

File Size 151.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 78511-425HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 25 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For 51142-0400 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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