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Amphenol Communications Solutions |
Part No. |
10121178-2010LF
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Description |
QSFP+ Cable Assembly, EDR, Passive, 28Gb/s, 30 AWG, 1.0 m, PVC jacket
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10071782-001LF
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Description |
Smart Card, Input Output Connectors, IC Chip Card Connector, 8 contacts, Surface Mount
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10121178-2030LF
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Description |
QSFP+ Cable Assembly, EDR, Passive, 28Gb/s, 30 AWG, 3.0 m, PVC jacket
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10121178-2025LF
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Description |
QSFP+ Cable Assembly, EDR, Passive, 28Gb/s, 30 AWG, 2.5 m, PVC jacket
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Tech specs |
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Official Product Page
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Bourns Inc. Bourns, Inc.
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Part No. |
CI160808-1N0D CI160808-1N2D CI160808-1N5D CI160808-2N2D CI160808-2N7D CI160808-6N8J CI160808-4N7D CI160808-8N2J CI160808-R22J CI160808-R27J CI160808-1N8D CI160808-56NJ CI160808-68NJ CI160808-18NJ CI160808-R15J CI160808-27NJ CI160808-R18J
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Description |
Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.15 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
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File Size |
243.82K /
2 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
10121178-2020LF
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Description |
QSFP+ Cable Assembly, EDR, Passive, 28Gb/s, 30 AWG, 2.0 m, PVC jacket
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10121178-2015LF
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Description |
QSFP+ Cable Assembly, EDR, Passive, 28Gb/s, 30 AWG, 1.5 m, PVC jacket
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10121178-2008LF
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Description |
QSFP+ Cable Assemblies, Cable Assemblies, 30AWG, 28 Gbps, 38 Position, 0.80mm (0.031in) Length.
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Tech specs |
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Official Product Page
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Bourns Electronic Solutions Bourns, Inc. BOURNS INC
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Part No. |
PM0603-3N9-RC PM0603-72NJ-RC PM0603-6N8J-RC PM0603-82NJ-RC PM0603-12NJ-RC PM0603-15NJ-RC PM0603-18NJ-RC PM0603-22NJ-RC PM0603-27NJ-RC PM0603-2N2-RC PM0603-33NJ-RC PM0603-39NJ-RC PM0603-47NJ-RC PM0603-4N7-RC PM0603-56NJ-RC PM0603-68NJ-RC PM0603-8N2J-RC PM0603-R10J-RC PM0603-R12J-RC PM0603-R15J-RC PM0603-R18J-RC PM0603-R22J-RC PM0603-R27J-RC PM0603-10NJ-RC
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Description |
PM0603 Series - High Q Chip Inductors Chip Inductor 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Chip Inductor 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD Chip Inductor 1 ELEMENT, 0.056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
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File Size |
214.36K /
1 Page |
View
it Online |
Download Datasheet
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Bom2Buy.com

Price and Availability
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Part: 17820 |
Maker: Intersil(英特矽尔) |
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