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CALMIRCO[California Micro Devices Corp]
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| Part No. |
CSPEMI200A CSPEMI200AG
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| OCR Text |
...tion Solder Mask Opening Solder stencil Thickness Solder stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum ... |
| Description |
4 Channel Headset EMI Filter with ESD Protection
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| File Size |
459.70K /
7 Page |
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it Online |
Download Datasheet
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CALMIRCO[California Micro Devices Corp]
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| Part No. |
CSPEMI204 CSPEMI204G
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| OCR Text |
...tion Solder Mask Opening Solder stencil Thickness Solder stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum ... |
| Description |
2 Channel Headset EMI Filter with ESD Protection
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| File Size |
234.31K /
6 Page |
View
it Online |
Download Datasheet |
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Motorola Mobility Holdings, Inc.
ONSEMI[ON Semiconductor]
MOTOROLA[Motorola Inc]
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| Part No. |
MSD1328-T1_D MSD1328-RT1 MSD1328RT1 ON2376
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| OCR Text |
...ice Data
MSD1328-RT1
SOLDER stencil GUIDELINES
Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste ... |
| Description |
NPN Low Voltage Output Amplifier Surface Mount 500 mA, 20 V, NPN, Si, SMALL SIGNAL TRANSISTOR
CASE 318D3, STYLE 1 SC9
From old datasheet system
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| File Size |
112.82K /
4 Page |
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it Online |
Download Datasheet |
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ONSEMI[ON Semiconductor]
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| Part No. |
MV2105 MMBV2107LT1 MV2101 MV2109RLRA MV2109RLRP LV2205 MMBV2101LT1-D
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| OCR Text |
... MV2109, LV2205, LV2209
SOLDER stencil GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste o... |
| Description |
Silicon Tuning Diodes 6.8 - 100 pF, 30 Volts Voltage Variable Capacitance Diodes
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| File Size |
70.43K /
8 Page |
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it Online |
Download Datasheet |
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ON Semi
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| Part No. |
BSP62T1_D ON0222
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| OCR Text |
...ce Data
4
BSP62T1
SOLDER stencil GUIDELINES
Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste ... |
| Description |
MEDIUM POWER PNP SILICON
From old datasheet system
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| File Size |
123.28K /
6 Page |
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it Online |
Download Datasheet |
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MOTOROLA[Motorola, Inc]
ON Semi
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| Part No. |
MSD601-ST1 MSD601-RT1 ON2380 MSD601RT1
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| OCR Text |
...
MSD601-RT1 MSD601-ST1
SOLDER stencil GUIDELINES
Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste ... |
| Description |
NPN General Purpose Amplifier Transistors Surface Mount
From old datasheet system
CASE 318D3, STYLE 1 SC9
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| File Size |
110.82K /
4 Page |
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it Online |
Download Datasheet |
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VICOR[Vicor Corporation]
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| Part No. |
16808
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| OCR Text |
....0004". Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad).
DETAIL C
PRODUCT APPLICATION SPECIFICATIONS
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| Description |
PCB LAYOUT DRAWING FOR MINI SIZE MODULE
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| File Size |
106.17K /
1 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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