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SIEMENS AG Infineon SIEMENS[Siemens Semiconductor Group]
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Part No. |
BSM150GB120DN2 C67076-A2108-A70
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Description |
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT08; No. of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Right Angle Plug IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
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File Size |
130.46K /
9 Page |
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it Online |
Download Datasheet |
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SIEMENS AG Infineon SIEMENS[Siemens Semiconductor Group]
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Part No. |
BSM50GB120DN2 C67076-A2105-A70
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Description |
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT08; No. of Contacts:18; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Right Angle Plug IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
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File Size |
111.59K /
9 Page |
View
it Online |
Download Datasheet |
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SAMSUNG SEMICONDUCTOR CO. LTD. Samsung Semiconductor Co., Ltd.
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Part No. |
K9F3208W0A-TCB0 K9F3208W0A-TIB0
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Description |
Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:metal; Series:TVPS00; Number of Contacts:37; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:metal; Series:TVPS00; No. of Contacts:37; Connector Shell Size:25; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight 4米8位NAND闪存
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File Size |
561.61K /
27 Page |
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it Online |
Download Datasheet |
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Price and Availability
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