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material-copper Datasheet PDF File

For material-copper Found Datasheets File :: 25831 Search Time::3.203ms
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				Diotec Elektronische DIOTEC[Diotec Semiconductor] Diotec Semiconductor AG
Part No.	ZMY200 ZMY4.3 ZMY4.7 ZMY110 ZMY150 ZMY3.9 ZMY75 ZMY5.1 ZMY16 ZMY160 ZMY56 ZMY10 ZMY100 ZMY36 ZMY18 ZMY180 ZMY62 ZMY68 ZMY12 ZMY120 ZMY82 ZMY91 ZMY39 ZMY51 ZMY15 ZMY20 ZMY30 ZMY33 ZMY47 ZMY13 ZMY130 ZMY1 ZMY11 ZMY22 ZMY24 ZMY27 ZMY43 ZMY5.6 ZMY6.2 ZMY6.8 ZMY7.5 ZMY8.2 ZMY9.1
OCR Text	...t approx. - Gewicht ca. Plastic material has UL classification 94V-0 Gehausematerial UL94V-0 klassifiziert 5.0 Type Typ 0.5 0.5 ...copper pads at each terminal Montage auf Leiterplatte mit 50 mm2 Kupferbelag (Lotpad) an jedem Ansch...
Description	Surface mount Silicon-Zener Diodes (non-planar technology) IEC AC Power Inlet; Voltage Rating: 250V; Current Rating: 15A; Mounting Type: Panel; Terminal Type: Tabs Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:21-41 Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:21-75 surface mount silicon Zener diodes 179.5 V, 1.3 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, DO-213AB
File Size	53.53K / 2 Page	View it Online	Download Datasheet

				SIEMENS AG Infineon SIEMENS[Siemens Semiconductor Group]
Part No.	BSP170P Q67041-S4018
OCR Text	... agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs inc...
Description	SIPMOS Power Transistor (P-Channel Enhancement mode Avalanche rated dv/dt rated) 1.9 A, 60 V, 0.3 ohm, P-CHANNEL, Si, POWER, MOSFET High Speed CMOS 8-Channel Analog Multiplexer/Demultiplexer 16-SOIC -55 to 125 SIPMOS ? Power Transistor From old datasheet system
File Size	151.13K / 9 Page	View it Online	Download Datasheet

				NXP Semiconductors N.V. PHILIPS[Philips Semiconductors]
Part No.	BYG60 BYG60D BYG60G BYG60J BYG60K BYG60M
OCR Text	...= VRMMmax. Dimensions in mm. Material: AL2O3 or epoxy-glass. Fig.6 Reverse current as a function of junction temperature; maximum values. Fig.7 Printed-circuit board for surface mounting. handbook, full pagewidth DUT + ...
Description	Fast soft-recovery controlled avalanche rectifiers
File Size	63.27K / 6 Page	View it Online	Download Datasheet

				ZF Electronics Corporation CHERRY[Cherry Semiconductor Corporation]
Part No.	CS209AYD14 CS209AYD8 CS209AYN8 CS209AYDR8 CS209AYDR14 CS209A
OCR Text	...e next step is to select a core material with low loss factor (inverse of Q). The loss factor can be represented by a resistance in series w...Copper Aluminum Brass 0.101" 0.125" 0.044" 0.053" 0.052" Note that the above is only a comparison am...
Description	ER 4C 4#16 PIN PLUG Proximity Detector
File Size	166.21K / 6 Page	View it Online	Download Datasheet

				SONY[Sony Corporation]
Part No.	CXA3068 CXA3068N
OCR Text	.... PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SSOP-16P-L01 SSOP016-P-0044 LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER / PALLADIUM PLATING COPPER / 42 ALLOY 0.1g --11-- 0.5 0.2 6.4 0.2 ...
Description	L-band Down Converter for Satellite Tuner
File Size	143.54K / 11 Page	View it Online	Download Datasheet

				Sony, Corp. SONY[Sony Corporation]
Part No.	CXD3519 CXD3519TQ
OCR Text	...2 PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.15g SONY CODE EIAJ CODE JEDEC CODE TQFP-48P-L061 P-TQFP48-7X7-0.5 TERMINAL TREATMENT TERMINAL MATERIAL PACKAGE MASS LEAD SPECIFICATIONS ITEM LEAD...
Description	Reference Voltage and Driver IC for LCD 参考电压和驱动IC液晶显示
File Size	136.71K / 8 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor Maxim Integrated Products
Part No.	MAX1546ETL
OCR Text	...ie Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: I. Classification of Moisture Sensitivity per JEDEC standard JESD22-112: 40-Pin QFN (6x6) Copper Solder Plate Silver-filled Epoxy Gold (1.3 mil dia.) Epo...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	119.24K / 8 Page	View it Online	Download Datasheet

				MAXIM - Dallas Semiconductor MAXIM[Maxim Integrated Products]
Part No.	MAX3801UGG
OCR Text	...ie Attach: E. Bondwire: F. Mold Material: G. Assembly Diagram: H. Flammability Rating: I. Classification of Moisture Sensitivity per JEDEC standard JESD22-A112: 24-Pin QFN Copper Solder Plate Silver-filled Epoxy Gold (1.2 mil dia.) Epoxy wi...
Description	PLASTIC ENCAPSULATED DEVICES
File Size	65.71K / 7 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	MC34268STT3 MC34268D MC34268DR2 MC34268DT MC34268DTR MC34268DTRK MC34268
OCR Text	...S OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A A1 B C D E e H h L MILLIMETERS MIN MAX 1.35 1.75 0.10 0.25 0.35 0.49 0.19 0.25 4.80 5.00 3.80 4.00 1.27 BSC 5.80 6.20 0.25 0.50 0.40 1.25 0_ 7_ A 8 D 5 C E 1 4 H ...
Description	SCSI-2 Active Terminator Regulator
File Size	115.61K / 8 Page	View it Online	Download Datasheet

				NICHIA CORPORATION Electronic Theatre Controls, Inc. ETC[ETC] List of Unclassifed Manufacturers
Part No.	NSPW300 NSPW300BS
OCR Text	... Please refer to figure's page. Material as follows ; Resin(Mold) : Leadframe : Epoxy Resin (over YAG Phosphor) Ag plating Copper Alloy -1- Nichia STSE-CW2157B <Cat.No.031110> 4.PACKAGING * The LEDs are packed in cardboard boxes a...
Description	NICHIA WHITE LED
File Size	329.17K / 15 Page	View it Online	Download Datasheet

For material-copper Found Datasheets File :: 25831 Search Time::3.203ms
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