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joints Datasheet PDF File

For joints Found Datasheets File :: 1460 Search Time::1ms
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				MOTOROLA[Motorola, Inc]
Part No.	MMBD2005T1 MMBD3005T1 MMBD1005LT1
OCR Text	..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description	Switching Diode
File Size	159.99K / 8 Page	View it Online	Download Datasheet

				Motorola Mobility Holdings, Inc. ON Semi MOTOROLA[Motorola, Inc]
Part No.	MMFT2406T1 MMFT2406T MMFT2406T1_D ON2217
OCR Text	..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description	MEDIUM POWER TMOS FET 700 mA 240 VOLTS 0.7 A, 240 V, 6 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-261AA N-hannel Enhancement-ode Logic Level SOT23 From old datasheet system
File Size	87.87K / 6 Page	View it Online	Download Datasheet

				MOTOROLA[Motorola, Inc]
Part No.	MSD42WT1 ON2379
OCR Text	..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description	From old datasheet system NPN GENERAL PURPOSE HIGH VOLTAGE TRANSISTORS SURFACE MOUNT
File Size	74.51K / 4 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors]
Part No.	P83C524 P83C524EBA P83C524EBB P83C524EBP P83C524EFA P83C524EFB P83C524EFP P83C524IBA P83C524IBB P83C524IBP P83C524IFA P83C524IFB P83C524IFP P83C528 P83C528EBA P83C528EBB P83C528EBP P83C528EFA P83C528EFB P83C528EFP P83C528IBA P83C528IBB P83C528IBP P83C528IFA P83C528IFB P83C528IFP P80C528 P80C528EBA P80C528EBB P80C528EBP P80C528EFA P80C528EFB P80C528EFP P80C528IBA P80C528IBB P80C528IBP P80C528IFA P80C528IFB P80C528IFP
OCR Text	...g or by wave Repairing soldered joints PLCC and QFP Reflow soldering Wave soldering Repairing soldered joints DEFINITIONS LIFE SUPPORT APPLICATIONS PURCHASE OF PHILIPS I2C COMPONENTS 1997 Dec 15 2 Philips Semiconductors Product ...
Description	8-bit microcontrollers
File Size	400.47K / 76 Page	View it Online	Download Datasheet

				ONSEMI[ON Semiconductor]
Part No.	DTC144T1 DTC144TT1
OCR Text	..., the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this...
Description	NPN Silicon Surface Mount Transistor with Monolithic Bias Resistor Network Bias Resistor Transistor
File Size	52.59K / 8 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	EMIF02-MIC03M611
OCR Text	...t solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placemen...
Description	2-line IPAD? EMI filter and ESD protection for microphone
File Size	311.32K / 11 Page	View it Online	Download Datasheet

				PHILIPS[Philips Semiconductors]
Part No.	PCD3360 PCD3360P PCD3360T
OCR Text	...g or by wave Repairing soldered joints SO Reflow soldering Wave soldering Repairing soldered joints LIFE SUPPORT APPLICATIONS PCD3360 1997 Jan 15 2 Philips Semiconductors Product specification Programmable multi-tone telep...
Description	Programmable multi-tone telephone ringer
File Size	108.41K / 20 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	EMIF02-SPK01M6
OCR Text	...t solder paste and cause solder joints to short. too low placement force can lead to insufficient contact between package and solder paste that could cause open solder joints or badly centered packages. 5. to improve the package placemen...
Description	2-line IPAD? EMI filter and ESD protection for speaker
File Size	144.49K / 11 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	MMBD330 MMBD330T1
OCR Text	..., the circuit boards and solder joints tend to heat first. the components on the board are then heated by conduction. the circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes thi...
Description	Switching Diode MINIBLOC
File Size	55.74K / 8 Page	View it Online	Download Datasheet

				AVX
Part No.	DP05A19207TR DP05A52507TR
OCR Text	... package and to ensure that all joints reflow properly. additional soak time and slower preheating time may be required to improve the out-gassing of solder paste. in addition, the reflow profile depends on the pcb density and the type of s...
Description	RF Modules Misc
File Size	604.40K / 12 Page	View it Online	Download Datasheet

For joints Found Datasheets File :: 1460 Search Time::1ms
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