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American Microsemiconductor Inc. America Semiconductor, ...
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Part No. |
2CL702CL712CL722CL732CL742CL75
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Description |
2CL70 2CL71 2CL72 2CL73 2CL74 2CL75 2CL70-74 high voltage diodes adopt the designing of high reliable multiple mesa structure and silicon tube, molded in small volume and compact packaging surface by epoxy resin.
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File Size |
1,116.42K /
3 Page |
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it Online |
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TOSHIBA
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Part No. |
JTC83230-0011S
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Description |
Single-Chip CMOS LSI for Calculators with printers (applicable printer heads: M-31 manufactured by EPSON) Single-Chip CMOS LSI for Calculators with printers
(applicable printer heads: M-31 manufactured by EPSON)
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File Size |
432.82K /
25 Page |
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it Online |
Download Datasheet |
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Advanced Micro Devices, Inc.
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Part No. |
AM29F040-120/BUA AM29F040-120/BXA AM29F040-150DEB AM29F040-120DEB AM29F040-90LE AM29F040-75FI AM29F040-75JC AM29F040-75JI AM29F040-90DEB
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Description |
150V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; A IRF3315S with Standard packaging 150V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3315S with Lead Free packaging 30V Single N-Channel HEXFET Power MOSFET in a D-Pak package; A IRLR8721PBF with Standard packaging 60V Single N-Channel HEXFET Power MOSFET in a TO-220AB package; A IRFZ34E with Standard packaging 100V Single N-Channel HEXFET Power MOSFET in a I-Pak package; A IRFU120Z with Standard packaging 55V Single N-Channel HEXFET Power MOSFET in a D-Pak package; Similar to IRFR48Z with Lead Free packaging 30V Single N-Channel HEXFET Power MOSFET in a TO-262 package; Similar to IRL3803L with Lead Free packaging 55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRFZ24NS with Lead Free packaging x8 Flash EEPROM x8闪存EEPROM
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File Size |
1,022.48K /
34 Page |
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it Online |
Download Datasheet |
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Price and Availability
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