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For epoxy Found Datasheets File :: 55291 Search Time::3.391ms
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				ROHM
Part No.	BD65492MUV BD65492MUV-E2
OCR Text	...25 c , when mounted on a glass epoxy 1-layer board (74.2mm x 74.2mm x 1.6mm) in surface layer copper foil area: 10.29mm 2 (note 2) reduced by 17.6mw/ c over 25 c , when mounted on a glass epoxy 4-layer board (74.2mm x 74.2mm x 1.6mm...
Description	2-Channel Lens Driver for Single-lens Reflex Cameras
File Size	502.80K / 17 Page	View it Online	Download Datasheet

				MIMIX[Mimix Broadband]
Part No.	XX1002
OCR Text	...on to allow either a conductive epoxy or eutectic solder die attach process. This device is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications. Absolute Maximum Ratings Supply Voltage (Vcc) Supply C...
Description	2.5-6.0/5.0-12.0 GHz GaAs MMIC Active Doubler
File Size	370.74K / 5 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	2SC603306
OCR Text	... Mounted on an FR4 board (glass epoxy, 1.6mm thick, Cu area: 64.5 mm2) Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this pr...
Description	Silicon NPN Epitaxial Type
File Size	207.78K / 5 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	2SC6061
OCR Text	... 2: Mounted on FR4 board (glass epoxy, 1.6mm thick, Cu area: 645 mm ) Note 3: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this ...
Description	Silicon NPN Epitaxial Type
File Size	200.35K / 5 Page	View it Online	Download Datasheet

				TOSHIBA
Part No.	TPH2R306NH
OCR Text	...te 3: device mounted on a glass-epoxy board (a), figure 5.1 note 4: device mounted on a glass-epoxy board (b), figure 5.2 note 5: v dd = 48 v, t ch = 25 (initial), l = 0.097 mh, i ar = 60 a fig. fig. fig. fig. 5.1 5.1 5.1 5.1 devic...
Description	Power MOSFET (N-ch single 30V<VDSS≤60V)
File Size	236.40K / 9 Page	View it Online	Download Datasheet

				Toshiba Corporation Toshiba Semiconductor
Part No.	CMF01
OCR Text	...64 t) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 6 mm x 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 2.1 mm x 1.4 mm) (board thickn...
Description	Zener Diode; Application: General; Pd (mW): 400; Vz (V): 9.5 to 9.9; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): ESD (kV) min: -; Package: MHD Switching Mode Power Supply Applications
File Size	168.60K / 4 Page	View it Online	Download Datasheet

				Toshiba Corporation Toshiba Semiconductor
Part No.	CMF02
OCR Text	...64 t) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 6 mm x 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 2.1 mm x 1.4 mm) (board thickn...
Description	Zener Diode; Application: General; Pd (mW): 400; Vz (V): 9.7 to 10.1; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MHD Zener Diode; Application: General; Pd (mW): 400; Vz (V): 9.7 to 10.1; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): ESD (kV) min: -; Package: MHD Switching Mode Power Supply Applications
File Size	160.07K / 4 Page	View it Online	Download Datasheet

				Toshiba Semiconductor
Part No.	CMF03
OCR Text	...64 t) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 6 mm x 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 2.1 mm x 1.4 mm) (board thickn...
Description	Switching Mode Power Supply Applications
File Size	163.34K / 4 Page	View it Online	Download Datasheet

				ST Microelectronics
Part No.	STTH2R02A STTH2R02U
OCR Text	...ace under each lead - sma/smb (epoxy fr4, e cu = 35 m) figure 13. thermal resistance, junction to ambient, versus copper surface under each lead do-15 (epoxy fr4, e cu = 35 m) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 150 q rr ;...
Description	Ultrafast recovery diode
File Size	116.22K / 9 Page	View it Online	Download Datasheet

				Toshiba Corporation Toshiba Semiconductor
Part No.	CMF04
OCR Text	...64 t) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 6 mm x 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 2.1 mm x 1.4 mm) (board thickn...
Description	Zener Diode; Application: General; Pd (mW): 400; Vz (V): 9.9 to 10.3; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): ESD (kV) min: -; Package: MHD Switching Mode Power Supply Applications
File Size	164.84K / 4 Page	View it Online	Download Datasheet

For epoxy Found Datasheets File :: 55291 Search Time::3.391ms
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