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  CCM04-1814 Datasheet PDF File

For CCM04-1814 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    0918143122 91814-3122 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143122 91814-3122 SD-91814-001
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 22 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 22 Circuits, Tin (Sn) over Nickel (Ni)
File Size 124.03K  /  3 Page

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Amphenol Communications Solutions
Part No. 70218-141LF
Description 4 Row Signal Header, Straight, Press-Fit
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    0918143124 91814-3124 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143124 91814-3124 SD-91814-001
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 24 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 24 Circuits, Tin (Sn) over Nickel (Ni)
File Size 124.03K  /  3 Page

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Amphenol Communications Solutions
Part No. 71918-140LF
Description Quickie® Eject Latch connector, 2.54mm(0.100in), Shrouded Header, Through Hole, Straight, Double Row, 40 Positions
Tech specs 　 　

Official Product Page

    0918143116 91814-3116 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143116 91814-3116 SD-91814-001
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 16 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 16 Circuits, Tin (Sn) over Nickel (Ni)
File Size 123.85K  /  3 Page

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Amphenol Communications Solutions
Part No. 89891-814HLF
Description REC VER THT 28pos
Tech specs 　 　

Official Product Page

    0918143126 91814-3126 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143126 91814-3126 SD-91814-001
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 26 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 26 Circuits, Tin (Sn) over Nickel (Ni)
File Size 124.03K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-818-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

    0918143140 91814-3140 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143140 91814-3140 SD-91814-001
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 40 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 40 Circuits, Tin (Sn) over Nickel (Ni)
File Size 124.03K  /  3 Page

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Amphenol Communications Solutions
Part No. 20021814-09506T4LF
Description Minitek127®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 6 Positions, 1.27 mm (.050in) * 1.27 mm (.050in) Pitch.
Tech specs 　 　

Official Product Page

    91814-3106 SD-91814-001 0918143106

Molex Electronics Ltd.
Part No. 91814-3106 SD-91814-001 0918143106
Description 2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 6 Circuits, Tin (Sn) over Nickel (Ni)
File Size 123.85K  /  3 Page

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Amphenol Communications Solutions
Part No. 59112-T40-18-140LF
Description Minitek® 2.00mm, Board to Board Connector, Unshrouded Stacking Header - Through Hole - Double row - 36 Positions - 2mm (0.079inch) - Vertical.
Tech specs 　 　

Official Product Page

    0918141210 SD-91814-002 91814-1210

Molex Electronics Ltd.
Part No. 0918141210 SD-91814-002 91814-1210
Description 2.54mm (.100) Pitch C-Grid III Dual Row Vertical Shrouded Header, 10 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100") Pitch C-Grid III Dual Row Vertical Shrouded Header, 10 Circuits, Tin (Sn) over Nickel (Ni)
File Size 161.30K  /  4 Page

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Amphenol Communications Solutions
Part No. 10131318-1411100LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, Gold Flash plating, Natural Color, 14 Positions, Non GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    0918143130 91814-3130 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143130 91814-3130 SD-91814-001
Description 2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 30 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 30 Circuits, Tin (Sn) over Nickel (Ni)
File Size 123.85K  /  3 Page

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Amphenol Communications Solutions
Part No. 10131318-14221G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 80u\\ Bright Tin plating, Black Color, 14 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs 　 　

Official Product Page

    0918143132 91814-3132 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143132 91814-3132 SD-91814-001
Description 2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 32 Circuits, Tin (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 32 Circuits, Tin (Sn) over Nickel (Ni)
File Size 123.85K  /  3 Page

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Amphenol Communications Solutions
Part No. 77315-418-14LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs 　 　

Official Product Page

    0918143138 91814-3138 SD-91814-001

Molex Electronics Ltd.
Part No. 0918143138 91814-3138 SD-91814-001
Description 2.54mm (.100") Pitch C-Grid III Dual Row Right Angle Shrouded Header, 38 Circuits, Tin (Sn)
2.54mm (.100) Pitch C-Grid III Dual Row Right Angle Shrouded Header, 38 Circuits, Tin (Sn)
File Size 123.85K  /  3 Page

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Amphenol Communications Solutions
Part No. 77311-518-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch.
Tech specs 　 　

Official Product Page

For CCM04-1814 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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