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				Motorola, Inc. MOTOROLA[Motorola, Inc]
Part No.	MPX7100 MPX7100A MPX7100AP MPX7100AS MPX7100ASX MPX7100D MPX7100DP MPX7100GP MPX7100GS MPX7100GSX MPX7100GVP MPX7100GVS MPX7100GVSX
OCR Text	...l SILICONE GEL DIE COAT WIRE bond WIRE bond LEAD FRAME DIFFERENTIAL/GAUGE ELEMENT P2 DIE bond LEAD FRAME Figure 4. Cross-Sectional Diagrams (Not to Scale) Figure 4 illustrates the absolute sensing configuration (righ...
Description	0 to 100 kPa (0 to 14.5 psi) 40 mV FULL SCALE SPAN (TYPICAL)
File Size	190.50K / 10 Page	View it Online	Download Datasheet

				Microsemi
Part No.	1N977DUR-1 1N977DUR-1E3 1N965CUR-1E3 1N973DUR-1 1N973DUR-1E3 1N976DUR-1E3 1N974DUR-1 1N974DUR-1E3 1N974CUR-1 1N974CUR-1E3 1N984CUR-1 1N984CUR-1E3 1N969CUR-1E3 1N987CUR-1 1N973CUR-1 1N973CUR-1E3 1N966CUR-1 1N966CUR-1E3 1N979DUR-1 1N979DUR-1E3 1N966DUR-1E3 1N976CUR-1 1N965DUR-1 1N965DUR-1E3 1N981CUR-1 1N986CUR-1 1N986DUR-1 1N986DUR-1E3 1N979CUR-1 1N979CUR-1E3 1N988DUR-1E3 1N967DUR-1E3 1N967CUR-1E3 1N968DUR-1 1N968DUR-1E3 1N983CUR-1E3 1N981DUR-1 1N987DUR-1 1N987DUR-1E3 1N969DUR-1 1N969DUR-1E3 1N985DUR-1 1N985DUR-1E3
OCR Text	...ature an internal metallurgical bond and are available in military qualified and commercial rohs compliant versions . military qualified versions are available on the 1n962bur - 1 through 1n992bur - 1 range of part numbers. do ...
Description	Zener Voltage Regulator Diode
File Size	300.52K / 6 Page	View it Online	Download Datasheet

				Microsemi
Part No.	1N5532CUR-1E3 1N5543BUR-1E3 1N5532AUR-1E3 1N5532BUR-1E3 1N5546DUR-1E3 1N5519CUR-1E3 1N5518DUR-1E3 1N5518AUR-1E3 1N5518BUR-1E3 1N5522AUR-1E3 1N5528AUR-1E3 1N5538AUR-1E3 1N5534AUR-1E3 1N5524AUR-1E3 1N5533AUR-1E3 1N5523AUR-1E3 1N5520AUR-1E3 1N5523BUR-1E3 1N5527AUR-1E3 1N5537AUR-1E3 1N5546CUR-1E3 1N5521AUR-1E3 1N5531AUR-1E3 1N5519BUR-1E3 1N5524BUR-1E3 1N5534BUR-1E3 1N5519DUR-1E3 1N5519AUR-1E3 1N5529AUR-1E3
OCR Text	...with an internal metallurgical bond option. this type of bonded zener package construction is also in jan, jantx, and jantxv military qualifications. microsemi also offers numerous other zener product s to meet higher and lower powe...
Description	Low Voltage Avalanche Zener
File Size	158.65K / 6 Page	View it Online	Download Datasheet

				Microsemi
Part No.	1N5532C-1E3 1N5543A-1E3 1N5543B-1E3 1N5543C-1E3 1N5543D-1E3 1N5532A-1E3 1N5532B-1E3 1N5545D-1E3 1N5518D-1E3 1N5518A-1E3 1N5518B-1E3 1N5519C-1E3 1N5527D-1E3 1N5520A-1E3 1N5518C-1E3 1N5528C-1E3 1N5528D-1E3 1N5523C-1E3 1N5529C-1E3 1N5546C-1E3 1N5519B-1E3 1N5524D-1E3 1N5534D-1E3 1N5527C-1E3
OCR Text	... ? internal metallurgical bond option available with - 1 suffix . ? jan, jantx, and jantxv qualification per mil - prf - 19500/437 available (requires metallurgical bond option as well as plus/minus 5% voltage tolerance or ...
Description	Low Voltage Avalanche Zener
File Size	141.85K / 5 Page	View it Online	Download Datasheet

				Micross Components
Part No.	HMC322
OCR Text	...thickness is 0.004. 3. typical bond pad is 0.004 square. 4. typical bond pad spacing is 0.006 center to center. 5. bond pad metallization: gold. 6. backside metallization: gold. 7. backside metal is ground. 8. no connection required f...
Description	Telecom Infrastructure
File Size	828.97K / 9 Page	View it Online	Download Datasheet

				Caddock Electronics, In...
Part No.	CD2015WBA CD2015FC
OCR Text	...cations. style wb - wire bond version for hybrid applications with metallized back surface for solder down heat sinking of the chip, includes bondable termination pedestals to receive aluminum wire bonds. ? resistance as...
Description	Type CD Low Resistance Precision Chip Resistors
File Size	371.12K / 2 Page	View it Online	Download Datasheet

				XILINX[Xilinx, Inc] Xilinx, Inc. Kontron AG XILINX INC
Part No.	XC2V1000 XC2V1000-4BF957C XC2V1000-4BF957I XC2V1000-4BG575C XC2V1000-4BG575I XC2V1000-4BG728C XC2V1000-4BG728I XC2V1000-4CS144C XC2V1000-4CS144I XC2V1000-4FF1152C XC2V1000-4FF1152I XC2V1000-4FF1517C XC2V1000-4FF1517I XC2V1000-4FF896C XC2V1000-4FF896I XC2V1000-4FG256C XC2V1000-4FG256I XC2V1000-4FG456C XC2V1000-4FG456I XC2V1000-4FG676C XC2V1000-4FG676I XC2V1000-5BF957C XC2V1000-5BF957I XC2V1000-5BG575C XC2V1000-5BG575I XC2V1000-5BG728C XC2V1000-5BG728I XC2V1000-5CS144C XC2V1000-5CS144I XC2V1000-5FF1152C XC2V1000-5FF1152I XC2V1000-5FF1517C XC2V1000-5FF1517I XC2V1000-5FF896C XC2V1000-5FF896I XC2V1000-5FG256C XC2V1000-5FG256I XC2V1000-5FG456C XC2V1000-5FG456I XC2V1000-5FG676C XC2V1000-5FG676I XC2V1000-6BF957C XC2V1000-6BF957I XC2V1000-6BG575C XC2V1000-6BG575I XC2V1000-6BG728C XC2V1000-6BG728I XC2V1000-6CS144C XC2V1000-6CS144I XC2V1000-6FF1152C XC2V1000-6FF1152I XC2V1000-6FF1517C XC2V1000-6FF1517I XC2V1000-6FF896C XC2V1000-6FF896I XC2V1000-6FG256C XC2V1000-6FG256I XC2V1000-6FG456C XC2V1000-6FG456I XC2V1000-6FG676C XC2V1000-6FG676I XC2V1500 XC2V1500-4BF957C XC2V1500-4BF957I XC2V1500-4BG575C XC2V1500-4BG575I XC2V1500-4BG728C XC2V1500-4BG728I XC2V1500-4CS144C XC2V1500-4CS144I XC2V1500-4FF11
OCR Text	...ogic support Flip-Chip and Wire-bond Ball Grid Array (BGA) packages in three standard fine pitches (0.80mm, 1.00mm, and 1.27mm) 100% factory tested - * * * * * * * * * * * * * (c) 2001 Xilinx, Inc. All right...
Description	Industry First Platform FPGA Solution 1.5VField-ProgrammableGateArrays IC REG LDO 1A 8V SHTDN TO220FP-5 Virtex-II 1.5V Field-Programmable Gate Arrays 的Virtex - II 1.5V的现场可编程门阵 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 1280 CLBS, 1000000 GATES, 650 MHz, PBGA575 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 1920 CLBS, 1500000 GATES, 650 MHz, PBGA575 1.5V Field-Programmable Gate Arrays 1.5V的现场可编程门阵 Virtex-II 1.5V Field-Programmable Gate Arrays Virtex - II 1.5V的现场可编程门阵 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 1920 CLBS, 1500000 GATES, 820 MHz, PBGA575 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 2688 CLBS, 2000000 GATES, 650 MHz, PBGA896 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 2688 CLBS, 2000000 GATES, 750 MHz, PBGA896 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 384 CLBS, 250000 GATES, 650 MHz, PBGA256 MS3470L16-26BN FPGA, 5760 CLBS, 4000000 GATES, 820 MHz, PBGA1517 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 384 CLBS, 250000 GATES, 650 MHz, PBGA144 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 1280 CLBS, 1000000 GATES, 650 MHz, PBGA896 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 2688 CLBS, 2000000 GATES, 750 MHz, PBGA957 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 3584 CLBS, 3000000 GATES, 820 MHz, PBGA957 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 11648 CLBS, 8000000 GATES, 750 MHz, PBGA1517 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 768 CLBS, 500000 GATES, 750 MHz, PBGA456 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 2688 CLBS, 2000000 GATES, 820 MHz, PBGA957 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 3584 CLBS, 3000000 GATES, 820 MHz, PBGA1152 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 1920 CLBS, 1500000 GATES, 820 MHz, PBGA896 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 1280 CLBS, 1000000 GATES, 820 MHz, PBGA896 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 128 CLBS, 80000 GATES, 750 MHz, PBGA144 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 1920 CLBS, 1500000 GATES, 820 MHz, PBGA676 Field-Programmable Gate Arrays FPGA, 1280 CLBS, 1000000 GATES, 820 MHz, PBGA456 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 3584 CLBS, 3000000 GATES, 750 MHz, PBGA676 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 3584 CLBS, 3000000 GATES, 750 MHz, PBGA1152 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 5760 CLBS, 4000000 GATES, 650 MHz, PBGA1517 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 5760 CLBS, 4000000 GATES, 750 MHz, PBGA1152 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 11648 CLBS, 8000000 GATES, 650 MHz, PBGA1517 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 768 CLBS, 500000 GATES, 750 MHz, PBGA256 Virtex-II 1.5V Field-Programmable Gate Arrays FPGA, 384 CLBS, 250000 GATES, 750 MHz, PBGA256
File Size	113.58K / 7 Page	View it Online	Download Datasheet

				Infineon Technologies A...
Part No.	SIDC85D170H-04
OCR Text	...d soft solder die bonding die bond electrically conductive glue or solder wire bond al, 500m reject ink dot size ? 0.65mm; max 1.2mm recommended storage environment store in original container, in dry nitrogen, < 6 mon...
Description	Fast switching diode chip in EMCON 3 -Technology
File Size	62.34K / 4 Page	View it Online	Download Datasheet

				Analog Devices
Part No.	HMC941A
OCR Text	...nches (millimeters). 2. typical bond pad is .004 square. 3. typical bond pad spacing is .006 center to center except as noted. 4. backside metalization: gold 5. backside metal is ground 6. bond pad metalization: gold at tenuators - chi...
Description	0.5 dB LSB GaAs MMIC 5-BIT DIGITAL ATTENUATOR, 0.1 - 30 GHz
File Size	393.98K / 6 Page	View it Online	Download Datasheet

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