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TriQuint Semiconductor, Inc.
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| Part No. |
TGS4305-FC
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| OCR Text |
...die component placement and die attach assembly notes: ? vacuum pencils and/or vacuum collets are the prefe rred method of pick up. ? air bridges must be avoided during placement. ? cu pillars on die are 65 um tall with a 22 um tall sn sold... |
| Description |
60 - 90 GHz SP3T Switch Flip Chip 60000 MHz - 90000 MHz RF/MICROWAVE SGL POLE TRIPLE THROW SWITCH, 3.75 dB INSERTION LOSS
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| File Size |
258.81K /
11 Page |
 View
it Online |
Download Datasheet
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Agilent(Hewlett-Packard)
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| Part No. |
E6584A
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| OCR Text |
... secondary pdp context request, attach accept, attach complete, attach reject, attach request, authentication and ciphering fail, authentication and ciphering reject, authentication and ciphering response, close multislot loop, close ... |
| Description |
Wireless Protocol Advisor
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| File Size |
1,032.88K /
8 Page |
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it Online |
Download Datasheet |
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Intersil, Corp.
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| Part No. |
ISL54064IRTZ
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| OCR Text |
...al sets , molding compounds/die attach materials , and 100% matte tin plate plus anneal (e3 termination finish, which is rohs compliant and compatible with both snpb and pb-free soldering opera tions). intersil pb-free products are msl c... |
| Description |
1.8V to 6.5V, Sub-ohm, Dual SPST Analog Switch with Negative Signal Capability and Click and Pop Elimination; Temperature Range: -40°C to 85°C; Package: 10-TDFN DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO10
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| File Size |
392.19K /
15 Page |
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it Online |
Download Datasheet |
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Price and Availability
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